102 DESIGN007 MAGAZINE I SEPTEMBER 2019
Siemens business, to tell us about their tools'
flex and rigid-flex design capabilities.
IPC E-Textiles 2019 to Address
Real World of Applications for
Multiple Markets E
IPC E-Textiles 2019—a two-day technical edu-
cation workshop for innovators, technologists
and OEMs/brands to learn about the latest in
the converging industries of textiles and elec-
tronics—will feature 14 technical presenta-
tions, tours of the Drexel Center for function-
al fabrics, a special interactive session, and
an IPC D-70 E-Textiles Committee Standards
meeting.
AT&S Stays on Track: Another Important
Growth Investment Initiated E
In the first quarter of 2019/20, AT&S recorded
a stable development overall, achieving reve-
nue at €222.7 million.
TPCA Releases New Version of
Technology Roadmap of Taiwan
PCB Industry E
The 2019 Technology Roadmap reflects the
technology leadership of Taiwan's PCB in-
dustry and the gap between Taiwan and its
competitive countries. It also enables the in-
dustry to review the gap between the tech-
nology level among its members and the en-
tire industry.
Ventec Expands Thermal Interface
Materials Range E
Ventec International Group Co. Ltd has added
two new thermally conductive, thin isolation
foil materials to its range of thermal interface
materials (TIM) under its distribution agree-
ment with EMI Thermal.
Standard of Excellence: How Strong
Is Your Vendor Partnership? E
Here are 10 questions to ask yourself when
testing the strength of your current partnership
with your vendor.
EPTE Newsletter:
JPCA Show 2019, Part 4 E
Manufacturing a custom product with 100+
processing steps can be tricky enough, but
when you add in a highly complex set of de-
sign attributes, pour engineering resources into
defining the process, and verify that it is re-
peatable and reliable, that comes with a cer-
tain sense of pride and satisfaction.
Flex Talk: When You Do Everything Right
and Something Still Goes Wrong E
This industry is full of tales describing the
work and effort needed to overcome fabrica-
tion hurdles to produce a complex design. Tara
Dunn shares a case study of one of those types
of designs.
Development of Flexible
Hybrid Electronics E
This article presents a hybrid manufactur-
ing process to manufacture FHE systems with
a two-layer interconnect structure utilizing
screen printing of silver conductive ink, filled
microvias to connect ink traces at the different
layers, and use of the traditional reflow process
to attach the semiconductor chips to the print-
ed substrates.
Mentor Tools: Optimized for Flex and
Rigid-flex Design E
With the launch of the new Flex007 section in
Design007 Magazine, we asked David Wiens,
product marketing manager with Mentor, a
