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102 DESIGN007 MAGAZINE I SEPTEMBER 2019 Siemens business, to tell us about their tools' flex and rigid-flex design capabilities. IPC E-Textiles 2019 to Address Real World of Applications for Multiple Markets E IPC E-Textiles 2019—a two-day technical edu- cation workshop for innovators, technologists and OEMs/brands to learn about the latest in the converging industries of textiles and elec- tronics—will feature 14 technical presenta- tions, tours of the Drexel Center for function- al fabrics, a special interactive session, and an IPC D-70 E-Textiles Committee Standards meeting. AT&S Stays on Track: Another Important Growth Investment Initiated E In the first quarter of 2019/20, AT&S recorded a stable development overall, achieving reve- nue at €222.7 million. TPCA Releases New Version of Technology Roadmap of Taiwan PCB Industry E The 2019 Technology Roadmap reflects the technology leadership of Taiwan's PCB in- dustry and the gap between Taiwan and its competitive countries. It also enables the in- dustry to review the gap between the tech- nology level among its members and the en- tire industry. Ventec Expands Thermal Interface Materials Range E Ventec International Group Co. Ltd has added two new thermally conductive, thin isolation foil materials to its range of thermal interface materials (TIM) under its distribution agree- ment with EMI Thermal. Standard of Excellence: How Strong Is Your Vendor Partnership? E Here are 10 questions to ask yourself when testing the strength of your current partnership with your vendor. EPTE Newsletter: JPCA Show 2019, Part 4 E Manufacturing a custom product with 100+ processing steps can be tricky enough, but when you add in a highly complex set of de- sign attributes, pour engineering resources into defining the process, and verify that it is re- peatable and reliable, that comes with a cer- tain sense of pride and satisfaction. Flex Talk: When You Do Everything Right and Something Still Goes Wrong E This industry is full of tales describing the work and effort needed to overcome fabrica- tion hurdles to produce a complex design. Tara Dunn shares a case study of one of those types of designs. Development of Flexible Hybrid Electronics E This article presents a hybrid manufactur- ing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the print- ed substrates. Mentor Tools: Optimized for Flex and Rigid-flex Design E With the launch of the new Flex007 section in Design007 Magazine, we asked David Wiens, product marketing manager with Mentor, a

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