112 DESIGN007 MAGAZINE I SEPTEMBER 2019
1
Beyond Design:
Stackup Planning, Part 5
E
Barry Olney describes the traditional stackup
structures that use a combination of signal and
power/ground planes. But to achieve the next
level in stackup design, one needs to not only
consider the placement of signal and plane lay-
ers in the stackup, but also visualize the elec-
tromagnetic fields that propagate the signals
through the substrate.
2
Bill Brooks on Teaching PCB Design
at Palomar College
E
Bill Brooks of Nordson
ASYMTEK recently spoke
with the I-Connect007 edi-
torial team about his histo-
ry in design and his time as
a PCB design instructor, the
curriculum he developed
and taught, and various techniques that might
be enacted today to better educate the design-
ers of tomorrow.
3
IPC High-reliability Forum and
Microvia Summit Review, Part II
E
The Microvia Summit provided updates on the
work of members of the IPC V-TSL-MVIA Weak
Interface Microvia Failures Technology Solu
-
tions Subcommittee and opportunities to learn
about latest developments in methods to reveal
and explain the presence of latent defects, iden
-
tify causes and cures, and be able to consistent-
ly and confidently supply reliable products.
4
Development of Flexible
Hybrid Electronics
E
This article will present a
hybrid manufacturing pro-
cess to manufacture FHE
systems with a two-layer
interconnect structure uti-
lizing screen printing of sil-
ver conductive ink, filled microvias to connect
ink traces at the different layers, and use of the
traditional reflow process to attach the semi-
conductor chips to the printed substrates.
Editor Picks from PCBDesign007 and Flex007
Bill Brooks
