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Submit Your Abstract Today Technologies Involved: Additive PCB technologies Semi Additive Processing (SAP) Modified Semi Additive Processing (mSAP) Printed Technologies Flexible Hybrid Electronics (FHE) Advanced HDI technology - subtractive etch processing Design Software Assembly Raw Materials Chemistry Molded Interconnect Devices Laser technology Inspection Equipment Additive Electronics Conference: PCB Scale to IC Scale October 24 - 25, 2019 DoubleTree by Hilton San Jose San Jose, California, USA About the Conference From smartphones to implantable medical devices, electronic designers and fabricators are continuously challenged to miniaturize the size of their products. The SMTA Additive Electronics Conference brings together practitioners looking at the SMT-SEMI convergence. Targeted at substrates with line space/width down to 5um, this conference will showcase substrate design and manufacturing technologies that will enable the next generation of electronic products. Lenora Clark MacDermid Enthone Conference Chair Tara Dunn Omni PCB Conference Chair Conference Co-Chairs: www.smta.org/additive

• Design007 Magazine - Sept. 2019
• Feature Contents — Streamlining Standards
• Additional Contents
• Flex007 Contents
• Column — Time to Streamline Standards
• Short — World's Smallest Accelerometer Points To New Era in Wearables, Gaming
• Feature Interview — Design For Excellence: Karen McConnell on Standards
• Short — Nylon as a Building Block for Transparent Electronic Devices?
• Feature Interview — The Convergence: IPC Merging CFX With IPC-2581
• Feature — Why Does the PCB Industry Still Use Gerber?
• Feature Interview — Emma Hudson on the Harmonization of Standards
• Feature Interview — So Many Standards Committees, So Little Time
• Short — Control of Excitons in a 2D Semiconductor
• Feature — ODB++: Transforming Ideas Into Products
• Feature — IPC-2581 Continues to Flourish
• Short — Researchers Demonstrate 3D Quantum Hall Effect for the First Time
• Feature Column — Realizing a Higher Standard for PCB Design
• Short — Graphene Layer Enables Advance in Super-Resolution Microscopy
• PCB007 Highlights
• Column — My 100th Column
• Column — Recent IPC DC Chapter Activities
• Short — Spreading Light Over Quantum Computers
• Column — A Proactive Approach to Controlled Impedance
• Short — Researchers Develop Rapid, Low-cost Method to 3D Print Microfluidic Devices
• Column — Six Key Points for Designing a Defect-free Conformal Coating Process
• Short — At the Edge of Chaos, Powerful New Electronics Could be Created
• MilAero007 Highlights
• Article — Insertion Loss Performance Differences Due to Plated & Circuit Structure
• Flex007 Column — Flex Standards in Flux
• Short — Earwear and Watches Expected to Drive Wearables Market at a CAGR of 7.9%
• Flex007 Feature Interview — Flex Standards Update With Nick Koop
• Flex007 News Highlights
• Flex007 Column — Standards: An Industrial-strength Glue
• Short — Wearable Sensors Detect What's in Your Sweat
• Flex007 Column — Monocoque Printed Circuits: An Update
• Top 10 Editor Picks from PCBDesign007 and Flex007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Information