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98 DESIGN007 MAGAZINE I SEPTEMBER 2019 Feature Interview by Andy Shaughnessy FLEX007 This month, I interviewed Nick Koop—direc- tor of flex technology at TTM Technologies, a veteran "flex guy" and instructor, and a leader of several IPC flex standards committees. Nick provides an update for the committees he's in - volved with and discusses some of the chal- lenges that he sees as more designers enter the world of flex. Andy Shaughnessy: Nick, tell us a little about your background and your work with flex and rigid-flex circuits at TTM. Nick Koop: I've worked in the flex and rigid-flex world since 1985 where my roles have ranged from process engineer to design engineer to general manager of a factory. And I've been with TTM since 2013. It has been a great expe - rience working with such a wide range of cus- tomers and programs, solving problems that lead to success for our customers. Shaughnessy: You're the vice-chair of the Flexi- ble Circuits Committee and co-chair of the 6013 Subcommittee. Give us some updates on the flex committees. Koop: All of the flex specifications are being re- viewed on an ongoing basis. We are close to releasing new versions of IPC-2223 and IPC- 6013. They will include more information on microvias, finished copper thickness, and oth - er member-requested updates. I would expect that to happen by early 2020. The supporting material specifications and test methods are also under review. In addition, there is work happening on the T-50 Terms and Definitions Guideline, which is in the middle of a substan - tial update. So, there is a lot happening on all fronts. Shaughnessy: We talk to a lot of rigid board de- signers who are being forced into flex design. Usually, they start with flex standards, and then hopefully, they will call a flex board shop. What advice would you give any rigid folks moving into the flex world? Koop: We are also seeing dramatic growth in flex use driven by several factors; space, weight, re- liability, and cost being some of the most com- Flex Standards Update With Nick Koop Nick Koop

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