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SEPTEMBER 2019 I PCB007 MAGAZINE 89 Example 2: 3D Imaging of Printed Features and Substrates in Printed and Flexible Electronics Applications The line confocal method works well in characterizing multi-material high-contrast surfaces that are typical in printed electron- ics products. The system's capability to image clear, highly reflective substrates with non- transparent and often matte conductive inks with the same parameter settings in a single pass speeds up scanning and analysis of the entire product. Figures 17–25 show a sequence to measure ink height (thickness) and width, gap width between traces, substrate radius, and thick- Figure 15: Extracted surface profile. Figure 14: Extracting copper surface profile from a single trace. Figure 16: Roughness measurements from the extracted profile. Figure 17: Digital microscope photo of the scanned area (note the tinted dielectric coating and reflections that are often a challenge for camera-based inspection systems).