Design007 Magazine
Design007-Oct2019
Issue link:
https://iconnect007.uberflip.com/i/1174596
Contents of this Issue
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Articles in this issue
Design007 Magazine - October 2019
Feature Content — The Landscape of the Design Industry
Additional Content
Flex007 Content
Column — The Landscape of the Design Community
Short — Making Waves With Metamaterials
Feature Interview — Traversing the Design Landscape With Hartley and Creeden
Feature Interview — Digi-Key on Adapting to the Changing Industry Landscape, Part 2
Short — Tiny Tweaks for Big Wins in Solar Cells
Feature Interview — Lee Ritchey on the Direction of PCB Design
PCB007 Highlights
Column — The First Open IPC DC Executive Board Meeting
Short — Bigger, Better Conductive Crystals a Boon for Electronics
Column — How Much Signal Do We Lose Due to Reflections?
Column — Design Challenges for Developing High-density 2.5D Interposers, Part 1
Column — Build Quality Into Your Boards and Processes
Column — Material Choices for 5G PCB Applications
Short — Neutrons: Lighting up Liquid Crystals
Column — Five Key Factors for Flexible Resins and Potting Sensitive Components
Short — Spying on Topology
MilAero007 Highlights
Column — What Does Intelligent Routing Look Like?
Short — New Topological Insulator Could Pave the Way for Making Faster Chips
Flex007 — The State of Flex Design
Flex Short — Microfluidic Devices Made of Wood
Flex007 Interview — Flex Design: Know Your Applications
Flex Short — New Coating Developed by Stanford Researchers Brings Lithium Metal Battery Closer to Reality
Flex007 News Highlights
Flex Column — Working With Flexible Circuits
Flex Column — Polymer Thick-film Circuits: Practical or Not?
Flex Short — Researchers Develop Low-power, Low-cost Network for 5G Connectivity
Top 10 Editor Picks from PCBDesign007 and Flex007
Career Opportunities Section
Events Calendar
Advertiser Index and Masthead
I-Connect007 Subscription and Contact Information
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