78 PCB007 MAGAZINE I OCTOBER 2019
1
Trouble in Your Tank: Via Hole
Filling and Plugging, Part 1 E
High-density interconnect
(HDI)
demands that vias
that do not contain compo-
nent leads be plugged with
either a polymeric paste or
electroplated copper. In this
column series, Michael Cara-
no talks about the technology drivers for via
filling/plugging in the context of HDI.
2
Additive Electronics Conference
Set for October 24, 2019 E
Tara Dunn, president of Om-
ni PCB and I-Connect007 col-
umnist, and Lenora Clark,
director
of autonomous driv-
ing and safety technology at
MacDermid Alpha Automo-
tive, discuss the upcoming Ad-
ditive Electronics Conference in San Jose, Cali-
fornia, on October 24, 2019; the impetus and
motiv
ation behind the conference; and who
can benefit the most from attending.
3
Dana on Data: IPC-2581 Intelligent
Bi-directional Data Flow E
The IPC Consortium is near-
ing completion of transfer-
ring notes on drawings and
working with IPC on con-
verting key IPC specifications
into attributes that can be au-
tomatically loaded into CAD
and CAM systems.
4
EPTE Newsletter: PCB Market
Trends in Taiwan E
PCB monthly shipments
for the first three quarters
show some positive growth
compared to the same pe-
riods of the previous year.
However, growth was stag-
nant during October and
November and declined
significantly in December.
Dominique Numakura
Editor Picks from PCB007
Dominique Numakura
Dana Korf
Tara Dunn
Michael Carano
