Issue link: https://iconnect007.uberflip.com/i/1181966
88 SMT007 MAGAZINE I NOVEMBER 2019 The solder paste deposits on the thermal pad are of interest to evaluate the area distributions by the aperture for Stencil A only to check if any solder deposit intersects the via land. The distributions in Figure 9 indicate slight overprinting (median is above the target value indicated by the black dotted line); however, the solder paste area is well below the value, which would indicate contact of the solder paste with any of the via placed in the ther- mal pad. The distributions in Figure 10 indicate slight overprinting (median is above the target value indicated by the black dotted line); however, the solder paste area is well below the value, which would indicate contact of the solder Figure 9: Thermal pad solder paste area distribution/single dot paste deposit; 5 x 5 via array with solder mask doughnut. Figure 10: Thermal pad solder paste area distribution/single dot paste deposit; 8 x 8 via array with solder mask doughnut.