Issue link: https://iconnect007.uberflip.com/i/1181966
92 SMT007 MAGAZINE I NOVEMBER 2019 Other inferences based on Table 5 data are as follows: • No solder mask doughnut around the vias allows for void <50% for all cases • For void% range of 25% ÷ 50%, and for void% <25%, the most favorable case is solder mask doughnut around via and a board thickness of 110 mils with solder paste dots Table 5: Tally of corrected void% range by board (sm=1: solder mask doughnut around via). Figure 15: PCA#13 corrected void percentage for reference designator G6 (via diameter f1 = 0.2 mm f 0.0098"). Figure 16: PCA#14 corrected void percentage for reference designator A1 (via diameter f1 = 0.2 mm f 0.00787"). Figure 17: PCA#15 corrected void percentage for reference designator G1 (via diameter f1 = 0.2 mm f 0.00787").