Issue link: https://iconnect007.uberflip.com/i/1181966
84 SMT007 MAGAZINE I NOVEMBER 2019 Experiment Design and Assembly Parameters Eighteen boards—nine for each stencil type and three for each board thickness—were assembled in a lead-free process using SAC305 solder paste and reflow profiles according to each board thickness. Table 2 describes the experiment factors. Table 3 lists the assembled board's characteristics. Table 1: Solder paste coverage. Figure 4: Dot and segmented apertures example. Table 2: DOE. Table 3: List of assembled boards.