Issue link: https://iconnect007.uberflip.com/i/1183414
104 DESIGN007 MAGAZINE I NOVEMBER 2019 We welcome the fact that standards for de- vice-embedded substrates recognize the ther- mal limitations of substrate materials. For ex- ample, standard IEC 62878-1 ED1 states, "Compared to the test severities applied to bare printed wiring boards, limitations exist, which are determined by the sensi- tivity of embedded components and sub- strate material. Requirements and sever- ities shall be defined between user and supplier." In our opinion, this is a good practice because users and suppliers can select temperatures that are relevant to the application environment. Two Organizations Create Printed Electronics Standards IEC and IPC are both active in printed electronics standardization. They have organized printed electronic standard de- velopment work into (technical) commit- tees. Figure 14 shows the working groups and sub-committees in them. The stan- dardization scopes are similar even if the naming differs. By June-2018, IEC had published around 20 standards and IPC around 10 standards for printed electronics [2 & 3] ; both organizations have many standards in the pipeline. Figure 13: Definitions for printed electronics and device-embedded substrates. Figure 14: IEC working groups and IPC sub-committees in printed electronics [4 & 5] .