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• PCB007 Magazine – November 2019
• Featured Content — From My Perspective
• Additional Content
• Column — Clarity of Vision
• Short — New Book Details Important Steps to Make Industry 4.0 a Reality
• Feature Interview — Tarja Rapala-Virtanen on Changing PCB Demands
• Feature Interview — A Young Engineer's Perspective on Joining the Industry
• Feature Interview — Sunstone Circuits on Staffing Trends in the Digital Age
• Short — BMW i Ventures Invest in Flexible Circuit Tech with CelLink
• Feature Interview — Thomas Michels on the Importance of Investment and Cooperation
• Short — Wurth Elektronik CBT, Taiyo America, Inc. Announce Successful Production of Inkjet Solder Mask
• Feature Interview — Industry Set for Shift to True 3D Printing and Photonics
• Short — RoboSense Wins CES 2020 Innovation Award for Autonomous Vehicle Technology
• MilAero007 Highlights
• Article — Undustry Wind Vane: Future Development Through the 2019 HKPCA Show
• Article — 5G Is Coming With Quantum-level Advances and Features
• Feature Interview — Chasing Down Materials for 5G and Beyond
• Electronics Industry News and Market Highlights
• Article — The CPCA and China's Electronic Circuit Industry: Past and Future
• Article — The Viability of a Cyanide-free Immersion Gold Bath
• Column — Go To Bed Hungry
• Supplier Highlights
• Column — Making Quality Initiatives Fun
• Short — Pacifier Biosensor Could Help Monitor Newborn Health
• Column — UV Cure LED Energy Saver
• Column — Changes and Concerns Regarding HDI Technology
• Short — iNEMI Publishes Organic PCB and Power Conversion Electronics Chapter from the 2019 Roadmap
• Top 10 Editor Picks from PCB007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Info.