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Hull Cell daisy chain results using Cupracid ® AC plated @ 1A for 10 min Front Back atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com ViaKing ® High layer count capable Flex and exotic material compatible Atotech's enhanced graphite based direct metalliza on process >10 Global references 50% of existing customers are using ViaKing ® for the production of flex and exotic dielectric materials Features and Benefits • Exceptional adhesion to a wide range of PCB materials making Viaking ® ideal for flex, flex-rigid, multilayer and HDI BMV production • Low copper etch depth – only 0.25 – 0.5 μm • Direct Cu-Cu adhesion for excellent joint reliability • Universal, quick, single or double pass process and no impact from low volume, or stop/start operations • Small particle size with controlled pH ensures that the colloid remains as a stable suspension preventing excessive sludge formation • Short horizontal process with low water consumption and chelator free for simple waste treatment • Easy to install into existing equipment