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44 PCB007 MAGAZINE I NOVEMBER 2019 setting has achieved certain results. How can HKPCA help companies to solve com- mon problems in this respect, carry out in-depth exchanges and cooperation in the field of smart manufacturing, make full use of their advantages and special- ties, and continuously strengthen the pro- motion of various collaborative projects? HKPCA: For PCB smart factories, smart logistics are the core, and the industrial internet of things (IIOT) is the means. The standardization of material loading and unloading in warehousing and equipment communication is fundamental. There are dif- ferent [HKPCA] committees to coordinate var- ious activities. We hope that through annual exhibitions, quarterly publications, and tech- nical seminars, members can understand the current market and trends and further explore various technological innovations. Every year, we interview major manufacturers and equip- ment suppliers in Hong Kong and South China to collect data and make market research re- ports. We hope to provide members with reli- able information and assist them in planning business development and technology upgrad- ing. We also have an industry standards group to focus on the development of international PCB manufacturing standards and actively communicate and coordinate solutions with relevant industry organizations. PCB007 China: The stability of the supply chain is very important for the development of the industry. The localization ability of key prod- ucts, a stable and healthy supply of raw materi- als, and the improvement of the smart logistics field all affect the development of PCBs in the future. At the same time, tariffs and new trade agreements are also very important factors in the change of international trade dynamics. How can the association lead such changes and help the industry to develop healthily and sustainably? HKPCA: Due to the formation of the buyer's market, the continuous shortening of the prod- uct life cycle, the increasingly fierce market competition, the rapid development of infor- mation technology, and other factors, the sup- ply chain presents an increasingly important trend. HKPCA has been committed to provid- ing a diversified communication platform for the industry, sharing the latest market infor- mation, and helping the industry to appropri- ately develop the relevant supply chain and technology to meet the needs of PCB products. With the increase of trade barriers and tariffs, the development of the supply chain will be- come more localized with an increase in inter- national trade costs. PCB007 China: In the field of technological in- novation, additive processes will be a signifi- cant pursuit in the future. There are many in- novations in the industry, including materials, equipment, and process reform. What are your expectations for the future? HKPCA: To meet the processing requirements of 40/40-μm products and below, the produc- tion of high-density circuits will gradually de- velop to meet the technical direction of carrier boards. With the demand for thinner end prod- ucts, the overall thickness of HDI products is getting thinner and thinner, and the thickness of the innerlayers is also becoming increasing- ly thinner. Regarding the material characteris- tics of mSAP boards, we mainly consider the Tg, CTE, Dk, and water absorption, as well as matching the degree of new materials to im- prove yield. Also, to meet the development of new tech- nology, some equipment manufacturers pro-