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NOVEMBER 2019 I PCB007 MAGAZINE 77 The results for both solderability methods are shown in Figures 28 and 29. The results for the CNF Au are better than the CN-containing gold types. The spread of the CNF Au result is greater, potentially be- cause the CNF Au is plated on both HP nickel and MP nickel. The one-way analysis to verify the signifi- cance of the results for the gold is represented Figure 26: ANOVA, a comparison of the shear strength for the nickel types. Figure 28: Solder indicator preparation and judgement. Figure 29: Solder spread preparation and judgement. Figure 30: The impact of ageing on the solderability of the gold types. Figure 31: ANOVA, analysis of the solder index value of the types of gold bath. Figure 27: A comparison of the CBP fracture modes for the nickel types. in Figures 31 and 32. Figure 31 confirms that the CNF Au gold bath performs better than the cyanide-containing gold baths. Figure 32 confirms that the CNF Au gold bath performs