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26 SMT007 MAGAZINE I FEBRUARY 2020 Using real data from quantitative measure- ments, certain 3D AOI systems feed correct com- ponent position values to component mounters and ensure components are mounted in the tar- geted position. This type of feature improves process repeatability by automatically adjusting component placement to the paste rather than to the pad location (Figure 5). Moreover, the software will identify the shift trend and con- duct further position correction by using true 3D measurement data from the AOI system. Connecting inspection systems with mount- ers can help achieve complete line communi- cation and further enhance the value of the inspection process. For example, M2M connec- tivity optimizes the process by exchanging real- time measurement data between the printer, SPI, mounters, and AOI systems. The systems feed offset and warning data to other systems while analyzing trends for process optimiza- tion and traceability. Combined, this process provides unsurpassed performance power. Communication between equipment will improve process repeatability by automatically adjusting component placement to the solder deposit rather than to the pad location. This advanced process further improves microchip mounting reliability. Networked intelligent systems that allow real-time results to be cor- related, calculated, and visualized will become even more essential in the smart factory. Conclusion Industry 4.0 and its associated benefits will help advance the industry. Equipment sup- pliers need to work diligently to accelerate M2M communication standards implementa- tion to help the situation. Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin the efforts within the industry to develop standards and cre- ate a smart factory. These M2M communica- tion standards, guided in part by Industry 4.0, are quickly altering the manufacturing process by improving metrics like first-pass yield and throughput by applying autonomous process adjustments. Far beyond an automatic line changeover, this two-way communication with suppliers will allow the equipment to automat- ically adjust production parameters to increase board quality and lower costs by eliminating rework and scrap. As part of this mission, APC with interconnected PCBA equipment will rev- olutionize process optimization and lay the foundation for the smart factory. SMT007 Brent Fischthal is the senior manager of marketing, Americas, for Koh Young America Inc. Figure 5: Example of pre-reflow 3D inspection detecting part skew, which is fed back to mounter.