Design007 Magazine

6 DESIGN007 MAGAZINE I FEBRUARY 2020 SHORTS: A Smart Surface for Smart Devices Bartolomeo Starts Its Journey to the International Space Station OMRON Donates $10,000 to Support Girls in STEM Intelligence-aided Manufacturing From Ucamco COLUMNS: DesignCon and IPC APEX EXPO Celebrate Milestone Anniversaries by Andy Shaughnessy The New Printed Circuit Engineering Association by Stephen V. Chavez You Can't Afford Not to Consider ISO 9001 by Bob Tise and Matt Stevenson Encapsulation Resins: What Could Go Wrong? by Alistair Little PCB Materials for High-power RF Applications by John Coonrod HIGHLIGHTS: PCB007 MilAero007 Top 10 PCBDesign007 & Flex007 DEPARTMENTS: Career Opportunities Events Calendar Advertiser Index & Masthead 19 34 68 73 10 36 64 70 74 62 78 94 97 106 107 FEBRUARY 2020 • ADDITIONAL CONTENTS 10 74

• Design007 Magazine – February 2020
• Feature Contents — EMI / Power Distribution
• Additional Contents
• Flex007 Contents
• Column — DesignCon and IPC APEX EXPO Celebrate Milestone Anniversaries
• Feature Interview — Avoiding EMI Problems With Lee Ritchey
• Short — A Smart Surface for Smart Devices
• Feature Interview — Eric Bogatin Looks at EMI Root Causes and Solutions
• Feature Column — PCB Fixtures for Power Integrity
• Short — Bartolomeo Starts Its Journey to the International Space Station
• Column — The New Printed Circuit Engineering Association
• Feature Column — The Impact of PDN Impedance on EMI
• Feature Column — Clearing Up the Buzz
• Feature Interview — EMI Challenges: A Contract Designer's Take
• PCB007 Highlights
• Column — You Can't Afford Not to Consider ISO 9001
• Short — OMRON Donates $10,000 to Support Girls in STEM
• Column — Encapsulation Resins: What Could Go Wrong?
• Video Interview — Intelligence-aided Manufacturing From Ucamco
• Column — PCB Materials for High-power RF Applications
• MilAero007 Highlights
• Flex007 Column — Flex Is Heating Up
• Flex007 Short — Gift Will Allow MIT Researchers to Use Artificial Intelligence in a Biomedical Device
• Flex007 Feature — Multi-board Etching: Managing Rigid-Flex Designs and Conductivity
• Flex007 Highlights
• Flex007 Column — Power and Thermal Management: Dealing With the Heat
• Flex007 Short — Thinfilm to Energize Innovation in the Wearables and Sensor Markets With Ultrathin, Flexible, Safe Batteries
• Top 10 Editor Picks from PCBDesign007 and Flex007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Info.