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• Design007 Magazine – February 2020
• Feature Contents — EMI / Power Distribution
• Additional Contents
• Flex007 Contents
• Column — DesignCon and IPC APEX EXPO Celebrate Milestone Anniversaries
• Feature Interview — Avoiding EMI Problems With Lee Ritchey
• Short — A Smart Surface for Smart Devices
• Feature Interview — Eric Bogatin Looks at EMI Root Causes and Solutions
• Feature Column — PCB Fixtures for Power Integrity
• Short — Bartolomeo Starts Its Journey to the International Space Station
• Column — The New Printed Circuit Engineering Association
• Feature Column — The Impact of PDN Impedance on EMI
• Feature Column — Clearing Up the Buzz
• Feature Interview — EMI Challenges: A Contract Designer's Take
• PCB007 Highlights
• Column — You Can't Afford Not to Consider ISO 9001
• Short — OMRON Donates $10,000 to Support Girls in STEM
• Column — Encapsulation Resins: What Could Go Wrong?
• Video Interview — Intelligence-aided Manufacturing From Ucamco
• Column — PCB Materials for High-power RF Applications
• MilAero007 Highlights
• Flex007 Column — Flex Is Heating Up
• Flex007 Short — Gift Will Allow MIT Researchers to Use Artificial Intelligence in a Biomedical Device
• Flex007 Feature — Multi-board Etching: Managing Rigid-Flex Designs and Conductivity
• Flex007 Highlights
• Flex007 Column — Power and Thermal Management: Dealing With the Heat
• Flex007 Short — Thinfilm to Energize Innovation in the Wearables and Sensor Markets With Ultrathin, Flexible, Safe Batteries
• Top 10 Editor Picks from PCBDesign007 and Flex007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Info.