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144 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2020 SHOW & TELL MAGAZINE Receiving Committee Leadership Awards for their contribution to D-33a Rigid Printed Board Performance Specification Task Group that developed IPC-6012E—Qualification and Performance Specification for Rigid Printed Boards—were Mark Beuchner, BAE Systems, and Randy Reed, R. Reed Consultancy LLC. Earning Distinguished Committee Service Awards for their dedication to developing IPC- 6012E were Lance Auer, Conductor Analysis Technologies Inc.; Scott Bowles, Lockheed Mar- tin Space Systems Company; Denise Charest, Amphenol Printed Circuits Inc.; Don Dupriest, Lockheed Martin Missiles and Fire Control; Gary Ferrari, FTG Circuits; Vicka Hammill, Honeywell Inc. Air Transport Systems; Philip Henault, Raytheon Missile Systems; Nick Koop, TTM Technologies Inc.; Clifford Maddox, Boe- ing Company; Chris Mahanna, Robisan Labo- ratory Inc.; Joey Rios, Raytheon Missile Sys- tems; Patrick Smith, Cirexx International; and Marshall Stolstrom, TTM Technologies. Earning Committee Leadership Awards for their outstanding contributions to the D-11 Flexible Circuits Design Subcommittee that developed IPC-2223E—Sectional Design Stan- dard for Flexible and Rigid-Flexible Printed Boards—were Mark Finstead, Flexible Circuit Technologies Inc., and Bill Ortloff, Raytheon Company. Receiving Distinguished Commit- tee Service Awards were Lance Auer, Conduc- tor Analysis Technologies Inc.; Gary Erickson, Sanmina Corporation; Kevin Kusiak, Lockheed Martin Space Systems Company; and Steven Murray, Northrop Grumman Corporation. For their leadership of the 5-21m Cold Joining Press-Fit Task Group that developed IPC-9797—Press-Fit Standard for Automo- tive Requirements and Other High-Reliability Applications—Hans-Peter Tranitz, Continental Automotive GmbH, and Udo Welzel, Robert Bosch GmbH, earned Committee Leadership Awards. Receiving Distinguished Committee Service Awards for the contributions to developing IPC-9797 were Erika Crandall, TE Connectivity Germany GmbH; Hermann Eicher, EPT Gugl- hoer GmbH; Philippe Jaeckle, Robert Bosch GmbH; Frank Uibel, Uibel Consulting; and Heike Woldt, Diehl Metal Applications GmbH. Receiving Committee Leadership Awards for their outstanding contributions to 5-33a Conformal Coating Task Group that developed IPC-CC-830C—Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies—were Brian Chislea, Dow Conformal coating task group.