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60 DESIGN007 MAGAZINE I MARCH 2020 ure. Choosing the correct resin is not as easy as it may seem, as there are so many variables to consider, such as typical operating condi- tions, expected extremes, the size and geome- try of the units, the need for repair, the expect- ed service life, etc. If the resin is too brittle, it can crack during operation and expose the electronics to potentially harmful chemicals. If the unit is expected to undergo cyclic thermal shock during its service life, then a flexible res- in would be advised, but it depends on the maximum and minimum temperature expect- ed. There is a lot of difference between –60 to +60°C and +40 to +160°C; both are a 120°C temperature difference, but for one, a polyure- thane resin would be recommended, while for the other, epoxy would be better. Conclusion If ever in doubt, refer to the technical data sheets (TDS); these can be a great help when you embark on a new design or production schedule with new components and resins. However, if you do anticipate any glitches with matching resin types to your production proce- dures and find it hard to resolve this from the TDS, please contact your supplier's technical support team for further advice. Next time, I will take an in-depth look at some of the most frequently asked questions fielded by our Tech- nical Support Team and explore options to fully address these enquirie s. DESIGN007 Alistair Little is the global business technical director of the resins division for Electrolube. To read past columns from Electrolube, click here. Download your free copy of Electrolube's book, The Printed Circuit Assembler's Guide to... Conformal Coatings for Harsh Environments, and watch their micro webinar series, "Coatings Uncoated". Judy Warner gets the update on IPC Design, the newly launched program, from Teresa Rowe and Patrick Crawford. They also discuss the impact on designers, the scope and cost of the program, how it will work, and where you can get more information. Click image to view video. IPC Design: The Newly Launched Program

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