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APRIL 2020 I SMT007 MAGAZINE 25 natively—and with the removal of the need for middleware—CFX demonstrates the advan- tages of collaboration in key areas of tech- nology, building the mechanism on which to effectively offer competitive solutions, which can all share and exchange data appropriately and securely. In manufacturing, we now look toward the next phase of standardization. The challenge is for us to extend interoperability and data- flow beyond simple shop-floor communica- tion. We know that a single company—no matter how large they may be—will never be able to bring a single solution for Industry 4.0 or smart manufacturing. From some vendors, however, we see demonstrations of amazing, Hollywood-inspired 3D user-interface graph- ics, which—in many cases—are simply gim- micks intended to distract customers from the short-comings of the solution, hiding the lack of depth of scope and support, as well as the need, almost always, for extremely expensive bespoke customization. It is an unfortunate practice of many com- panies in the industry to reveal the true cost of setting up and using solutions only after an initial purchase order has been given and an irreversible commitment made. This is not a sustainable business model and is regarded by many as being akin to "poison" in the market in that those taken in by such promises no lon- ger trust anyone's solutions and are, therefore, hesitant to move forward. In the real world, there are simply too many distinct areas within overall assembly manufacturing, each of which needs to be understood at a detailed level— such as comparing the processing of real-time X-ray image-based defect detection—with the need to manage moisture-sensitive materials. As with our human social groups, the focused skills and strengths of different companies need to be combined for the best results. The new IPC-2551 digital twin standard cur- rently in development seeks to create an envi- ronment of interoperability that allows solu- tion and technology providers to collaborate, exchanging information, together bringing an order of magnitude greater value than could be achieved through any single disconnected source. The IPC digital twin standard sets out the top-down hierarchical structure, through which applications can identify and commu- nicate active and useful elements of digital twin data, in any depth of detail, using stan- dard formats. The intention is to utilize existing open stan- dards throughout the various levels of detail needed, with references—for example—to existing related IPC standards, such as IPC- 2581 (Digital Product Model Exchange DPMX), IPC-2591 (IPC-CFX) and IPC-1782 (traceabil- ity). Non-IPC standards, such as JEDEC JEP-30 3D component data standards, are also being considered. This is expected to fast-track adop- tion of the IPC digital twin standard, without having to reinvent current standards and radi- cally change data flow practices. Though the development of the IPC digital twin standard is still ongoing and, therefore, subject to change, the organization of the dig- ital twin infrastructure is currently as follows. The root level of the cellular IPC digital twin standard is referred to as the "global" cell, com- prising three hierarchical root structures, each of which represents key areas as follows. 1. Product The IPC digital twin represents either a single product design instance or a range of closely related product variants and revisions. Infor- mation includes: a. The design intent, including specification, requirements, use-case metrics, environmental limitations, etc. b. The mechanical and electronic design, including 3D representations. c. The intended bill of materials, including vendor selection, engineering change history, variant definition, etc. 2. Manufacturing Includes the complete hierarchy of assembly manufacturing facilities, starting at the enter- prise level, breaking down into sites, discrete configurations, lines, cells, machines, and beyond, each modelled in terms of their spec- ification, capabilities, performance, and yield based on design features.