Issue link: https://iconnect007.uberflip.com/i/1243344
32 SMT007 MAGAZINE I MAY 2020 Guide to...Low-Temperature Soldering, BR Publishing Inc., 2018. 9. Ribas, M., Vangapandu, B., Rangaraju, R. R., Telu, S., Pai, L., Kumar, R., Patil, V., Ramakrishna, H. V., Cucu, T., and Sarkar, S., "Low-Temperature Soldering: Reflow Optimiza- tion for Enhanced Mechanical Reliability," Proceedings of the 2018 SMTA International Conference, Rosemont, Illi- nois, October 2018. 10. Ribas, M., Kumar, A., Kosuri, D., Rangaraju, R. R., Choudhury, P., Telu, S., and Sarkar, S., "Low-temperature Soldering Using Sn-Bi Alloys," Proceedings of the SMTA International Conference and Exhibition, Rosemont, Illi- nois, September 2017. 11. Ribas, M., Augustine, P., Choudhury, P., Rangaraju, R. R., Kumar, A., and Sarkar, S., "Low-Temperature Soldering: Thermal Cycling Reliability Performance," Proceedings of IPC APEX EXPO, San Diego, California, January 2019. Dr. Pritha Choudhury is sr. scientist of R&D at MacDermid Alpha Electronics Solutions. Dr. Morgana Ribas is a sr. R&D manager of the Metals Technology Group at MacDermid Alpha Electronics Solutions. Raghu Rangaraju is a R&D scientist at MacDermid Alpha Electronics Solutions. Dr. Siuli Sarkar is director of R&D, India Research Centre at MacDermid Alpha Electronics Solutions. All the authors are located at the MacDermid Alpha Electronics Solutions India Research Centre, Bangalore, India. are also grateful to other colleagues that par- ticipated in the discussion of the work from which this manuscript is derived. SMT007 References 1. Aspandiar, R., Byrd, K., Tang, K. K., Campbell, L., and Mokler, S., "Investigation of Low-temperature Solders to Reduce Reflow temperature, Improve SMT Yields and Real- ize Energy Savings," Proceedings of IPC APEX EXPO, San Diego, California, February 2015. 2. Osgood, H. R., Geiger, D., Pennings, R., Biederman, C., Jiang, J., and Bernal, J., "Low-Temperature SMT Solder Evaluation," Proceedings of IPC APEX EXPO, San Diego, California, January 2019. 3. Loh, W. H., and Fu, H., "Package-on-Package Warp- age Characteristics and Requirements," SMT Magazine, July 2016, pp. 68–76. 4. Mokhtari, O., and Nishikawa, H., "Coarsening of Bi phase and intermetallic layer thickness in Sn-58Bi-X (X = In and Ni) solder joints," Proceedings of the 14 th Inter- national Conference on Electronic Packaging Technology, pp. 250–253. 5. Fu, H., Aspandiar, R., Chen, J., Cheng, S., Chen, Q., Coyle, R., Feng, S., Krmpotich, M., Lasky, R., Mokler, S., Radhakrishnan, J., Ribas, M., Sandy-Smith, B., Tang, K. K., Wu, G., Zhang, A., and Zhen, W., "iNEMI Project on Pro- cess Development of BiSn-Based Low-Temperature Solder Pastes," Proceedings of the 2017 SMTA International Con- ference, Rosemont, Illinois, September 2017, pp. 207–220. 6. Fu, H., Radhakrishnan, J., Ribas, M., Aspandiar, R., Byrd, K., Chen, J., Cheng, S., Chen, Q., Coyle, R., Feng, S., Hardin, B., Krmpotich, M., Mokler, S., Sandy-Smith, B., Tang, K. K., Wu, G., Zhang, A., and Zhen, W., "iNEMI Project on Pro- cess Development of BiSn-Based Low-Temperature Sol- der Pastes–Part III: Mechanical Shock Tests on POP BGA Assemblies," Proceedings of the 2018 International Con- ference on Electronics Packaging, Kuwana, Japan, April 2018. 7. Fu, H., Radhakrishnan, J., Ribas, M., Aspandiar, R., Arfaei, B., Byrd, K., Chen, J., Cheng, S., Chen, Q., Coyle, R., Daily, D., Feng, S., Krmpotich, M., Mokler, S., Sandy-Smith, B., Tang, K. K., Wu, G., Zhang, A., and Zhen, W., "iNEMI Proj- ect on Process Development of BiSn-Based Low-Temper- ature Solder Pastes–Part IV: Comprehensive Mechanical Shock Tests on POP Components Having Mixed BGA BiSn- SAC Solder Joints," Proceedings of the 2018 SMTA Interna- tional Conference, Rosemont, Illinois, October 2018. 8. Ribas, M., Hunsinger, T., Cucu, T., Ramakrishna, H. V., Lim, G., and Murphy, M., The Printed Circuit Assembler's