Issue link: https://iconnect007.uberflip.com/i/1243344
42 SMT007 MAGAZINE I MAY 2020 the different tests and descriptions, the 25 dif- ferent tests that are embedded in here, the bill of materials, a sample size calculator, the area ratios and reference designators, the step-by- step solder paste test process, and the score- card. We haven't talked about scorecards yet, but that is where you rank paste performance relative to each other and look at each category of reflow, print, testability, supplier value, etc., and determine which paste gives you the best results. When some are categorized, you can say, "I'm going to trade off some reflow prop- erties for better printing and a little response to idle time for better voiding." You can see that all on the scorecard. Johnson: There certainly seems to be an increased specialization with respect to what the solder pastes do—what they're strong in, and what they're weak in. It's not a "one paste fits all" industry any longer. Does this test vehi- cle enable an assembler to characterize their line on all the different pastes they may plan to use or the various process windows, or is there Practical Components. They order and stock the components, and every component has a part number from Practical Components to make it easy to order. Also, it has the descrip- tion, so if you have some oxidized 0201s on the shelf and you'd rather use those than the bright shiny new solderable ones from Prac- tical, you can do that. I suggest that in a lot of cases. You can determine how much you want to order from Practical, and they'll walk you through the order, and they have all the sup- porting documentation that they will email to you as well, which is the bill of materials and the step-by-step instructions. There are four or five pieces there that they email out in the package. Johnson: Who should someone contact to start the process? Shea: Contact Practical Components. They should send you a documentation package. What is in that package right now is a list of all An overview of solder paste characteristics.