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macdermidalpha.com © 2020 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. MAcuspec thf 100 REVOLUTIONARY SINGLE STEP COPPER THROUGH HOLE FILL • Cavity free filling of through holes in core PCB layer • Minimal surface copper buildup, excellent for HDI designs • Capable of filling laser and mechanically drilled through holes • Drastically reduced plating times • Elimination of conductive plug and planarization processes Providing Solutions for Thermal Design Evolution in IC Substrates 2-Step Through Hole Filling MacuSpec THF 100 MacuSpec THF 100 Direct Current Plating

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