Issue link: https://iconnect007.uberflip.com/i/1248324
MAY 2020 I PCB007 MAGAZINE 69 Figure 17: Sinter via, reflowed ball kit, and ISC elastomer return loss. Figure 18: All test samples, insertion loss. baseline performed better, showing higher re- turn loss values through 35 Ghz. The reflowed ball kit performed in a similar fashion, and it was improved over the elastomer (Figure 17). To evaluate insertion loss, S21 tests were re- viewed for each of the test samples. Figure 18 shows an overlay of all tests. The graph shows that most of the intercon-