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2 µm atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com CupraEtch ® SR8000 Dryfilm and soldermask pretreatment with advanced adhesion performance Excellent dryfilm and soldermask adhesion CupraEtch ® SR8000 is a cupric chloride based microetching system with unique additives. The simple three step process creates uniform roughening of surface at low temperatures. Atotech's cost-effective pretreatment easily drops into existing lines and reliably improves the adhesion of all copper types to industry standard dryfilm and soldermask types. Metal complex free solution benefits in cost-effective waste water treatment. Pic. 1: CupraEtch ® SR8000 etched Cu Metal complex free solution

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