Issue link: https://iconnect007.uberflip.com/i/1269815
52 PCB007 MAGAZINE I JUNE 2020 flex, rigid-flex, and HDI production. An exam- ple of the Polygon P/LB is installed at our tech- nical center in Guangzhou, China, and is avail- able for customer inspection and sampling. Since its launch, a number of Polygon systems have been installed, with more currently on or- der for delivery later this year. Last but not least, let me briefly emphasize our vertical systems. vPlate is our new vertical panel and pattern plating equipment for PCB targeting fine line and space application down to approx. 8/8µm. Used in combination with our existing vertical process chemistry, vPlate extends our unique and successful system ap- proach to cover both horizontal and vertical process users. Meanwhile, MultiPlate is a revo- lutionary wafer and panel-level packaging tool designed to process embedded systems, SiP, or other advanced packaging technologies. With this development, we are at the forefront of packaging development and offer excellent de- position quality with the highest performance in RDL, pillar, and tall pillar plating. Matties: Is there anything else that we haven't talked about that you feel like our readers should know? Schatz: In the field of horizontal plating, we are proud to announce that we are about to launch a new horizontal system for pattern plat- ing—Uniplate IP3. This is a unique and revolu- tionary product. It's the first horizontal pattern plater for (a)mSAP ap- plications in the market and is based on the ex- periences gained install- ing nearly 1,000 Uni- plate lines worldwide. With Uniplate IP3, we have developed some- thing truly special for all high-end PCB mak- ers. The highlight of this new tool is the anode fluid basket, which con- trols the panel position in the middle of the an- ode pair. In combination with a number of oth- er improvements, and with an increased nozzle density per anode, we are now able to support the panel within the process fluid itself. This means that apart from the main panel clamps, which are always needed to deliver the plating current, there is no other surface contact across the PCB during electrolytic plating. This new feature brings two major advan- tages: no contact in the active surface area minimizes the risk of dry film damage and the associated plating defects, and the equidis- tant position between the top and bottom an- odes helps to further improve thickness varia- tions between both sides of the panel—both of which are essential when targeting fine line pattern plate products! Matties: Andreas and Daniel, this has been wonderful. I appreciate your time today. Schatz: You're welcome. Thank you very much for having us. Schmidt: Thank you, Barry. We appreciate you visiting. Matties: It has been our pleasure. PCB007 Atotech equipment product portfolio.