Issue link: https://iconnect007.uberflip.com/i/1269815
94 PCB007 MAGAZINE I JUNE 2020 try? Belis took the example of chromium plat- ing of automotive parts and commented that the OEMs needed a balance between aesthetics and functionality while controlling costs. Com- ponents varied in geometrical complexity. The throwing power of copper, nickel, and chrome plating processes ranged from reasonable to very poor, so accurate prediction of the thick- ness distribution of each metal layer was essen- tial for both quality and cost control. Elsyca's simulation software was widely employed; in fact, simulation capability was seen as an es- sential requirement in the vendor approval of plating contractors to automotive OEMs. Belis's comments raised another interesting point about how simulation was not just an aide to getting right-first-time results in pro- duction; it was a very effective communication tool in discussion with end-customers when used to illustrate graphically the effect of pro- posed changes—even when talking with non- technical people. Quality assurance was a further topic we discussed. Simulation data became a valuable constituent of the full panel history of the job and gave a new perspective on the tradition- al reliance on test coupons. Test coupons are typically incorporated into non-functional ar- eas on panel borders. In terms of plating thick- nesses, they can tell you something about the coupon itself but don't provide very meaning- ful information on layer thicknesses a few cen- timetres away, whether on the surface or down the holes. Yes, the PCB industry has been slow to adopt simulation tools. This has partly been due to a lack of awareness of their availability and capability, as well as a clinging-on to a reliance on traditional skills and experience. Belis used the analogy of a carpen- ter working with hand tools and being intro- duced to an electric drill: he was apprehensive un- boards; the finished copper thickness will be greater on circuit boards positioned near the panel edges. As Belis continued to explain, the CAM engi- neer can use Elsyca PCBPlate simulation soft- ware to quickly identify any out-of-spec areas by estimating the finished copper layer thick- ness for single or multiple panels and compar- ing the finished copper thickness distribution for different panel layouts. Then, they have the option of modifying the panel layout or using the copper balancing algorithm to add dum- my copper features near the panel edges and between individual boards to achieve a more uniform distribution of finished copper thick- ness across the entire panel. They can also re- solve any out-of-specification issues without the need for guesswork or trial-and-error. The graphical overview also enables the CAM engineer to identify the most critical areas and advise which features on which PCBs may need critical inspection and test—through-hole copper thickness, for example—and eliminate the need for expensive set-up changes during production. In addition, Elsyca's simulation software can enable process engineers to run in-depth what-if analyses and explore various scenarios to fine-tune process parameters and production settings on a digital twin of the pro- duction line. The PCB industry has been slow to adopt simulation techniques for the plating process. What about the general metal finishing indus-