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AUGUST 2020 I PCB007 MAGAZINE 57 the Pd-Tech® PC Pd layers. The test was re- peated over the full lifetime of the bath and with layer thicknesses of 160 nm and 400 nm of palladium. Nickel and gold layer thickness- es were kept the same for all conditions. Thirty solder balls of a SAC 305 solder with a ball di- ameter of 450 µm were applied on 380 µm SR- openings and sheared per test condition with a shear speed of 1.2 m/s and a shear height of 20 µm. Shear energy and fracture modes were observed to be comparable for both processes having a constant performance over the full lifetime of the bath. No significant difference could be observed between the new Pd-Core® finish and the mass production proven Pd- Tech® PC palladium (Figure 4). Also, looking into the formation of the inter- metallic component of both finishes, the ap- pearance is comparable, and no difference can be identified (Figure 5). Figure 5: Cross-section of the IMC formed after 1x and 3x reflow with ENEPIG finishes with 160 and 400 nm of palladium. Figure 4: Total energy values for high-speed shear testing of ENEPIG layers with Pd-Core® and Pd-Tech® PC palladium. Figure 3: Selective wave soldering results on 0.8-mm PTH with Pd-Core® and Pd-Tech® PC palladium layers with 160 nm and 400 nm Pd layer thickness at different aging conditions.