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• Design007 Magazine – September 2020
• Feature Contents — Thermal Management
• Additional Contents
• FLEX007 Contents
• Column — Thermal Management Is a Multi-Pronged Effort
• Feature Interview — Thermal Fundamentals With Mike Jouppi
• Feature — Thermal Management: Don't Believe the Datasheets
• Column — Stackup Planning, Part 6: Impedance Variables
• Feature — Stop Relating Trace Temperature to Current Density
• Feature Interview — Combatting Thermal Challenges With TRM Software
• Feature Column — 5 Questions About Improving Thermal Management
• Feature Interview — IMS Materials for Improved Thermal Management
• Short — Allegro MicroSystems Acquires Voxel, Inc. to Drive Eye-Safe LiDAR Solutions
• Feature Interview — Everything You Need to Know to Beat the Heat
• PCB007 Highlights
• Feature Column — Thermal Management for PCB Designers: Staying Out of the Fire
• Short — HiPhi X Launches With Electronically Controlled NT Door System
• Feature — An Excerpt From the Book 'Thermal Management: A Fabricator's Perspective'
• Feature Interview — Thermal Laminates: One More Tool in Your Toolbox
• MilAero007 Highlights
• Interview — Monsoon Solutions: Creating the Perfect Fab Notes, Part 2
• Column — How to Know If a CAD Tool Is Right for You
• Column — IPC-2231 Captures Board Design Best Practices
• Short — Veoneer, Qualcomm to Power Next Generation ADAS and Autonomous Driving Systems
• Column — Education Unlocks the Golden Door to Freedom
• Short — Nordson Acquires vivaMOS, Adding Key Sensor Technology
• Column — Key Benefits of Resins and Differences From Coatings
• Short — Ethertronics Releases First UWB Antenna Solutions for Samsung Electronics
• FLEX007 Column — Let's Talk About the Basics of Flex
• FLEX007 Short — Foresight Completes Development of Automatic Calibration Software
• FLEX007 Column — Thermal Management: Electronic Technology's Rodney Dangerfield
• FLEX007 Article — Documenting Your Flex Circuit Design
• FLEX007 Highlights
• FLEX007 Column — Next-Generation Flex Circuits: Textile Base Flex
• FLEX007 Short — Kneron Boosts On-Device Edge AI Computing Performance With Cadence Tensilica IP
• Top 10 Editor Picks from PCBDesign007.com
• Career Opportunities Section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Information