Issue link: https://iconnect007.uberflip.com/i/1293772
OCTOBER 2020 I SMT007 MAGAZINE 13 As stated before, the framework efforts should include updating solder alloy impuri- ties and differentiating dopants from impuri- ties. I have laid out the skeletal framework that is to be considered in three distinct categories of elements: 1. Current impurities elements (Table 3-2 of J-STD-006): Ag, Cd, Pb, Al, Cu, Sn, As, Fe, Zn, Au, In, Sb, Bi, and Ni. 2. Additional elements to be considered (phosphorus, sulfur, others). It is worth noting that QQ-S-571F (Federal Specification: Solder, Electronic) limits phosphorous (P) at 0.010 wt % and sulfur (S) at 0.005 wt %, but J-STD-006 makes no call on these two elements, which could potentially affect the properties and behavior of a solder alloy. 3. Dopants being used in alloys that are listed in the current impurity table as impurities (e.g., Ni, others). To move forward to the next stage of the development of J-STD-006, these areas are to be addressed, which will call for collaborative efforts from both suppliers and users of the industry, as well as any interesting parties. I would also like to take this opportunity to invite and encourage the industry colleagues to attend and participate in the task group meetings. The next in-person meeting, if feasi- ble, will be likely held at IPC APEX EXPO 2021 in San Diego, California (time and date to be determined). SMT007 Dr. Jennie S. Hwang—an inter- national businesswoman and speaker and a business and tech- nology advisor—is a pioneer and long-standing leader to SMT man- ufacturing since its inception as well as to the development and implementation of lead-free electronics technology. Among her many awards and honors, she was inducted to the International Hall of Fame–Women in Technology, elected to the National Academy of Engineering, named an R&D Star to Watch, and received a YWCA Achieve- ment Award. Having held senior executive positions with Lockheed Martin Corp., Sherwin Williams Co., and SCM Corp., she was the CEO of International Electronic Mate- rials Corp. and is currently CEO of H-Technologies Group, providing business, technology, and manufacturing solu- tions. She has served on the board of Fortune-500 NYSE companies and civic and university boards; the Com- merce Department's Export Council; the National Mate- rials and Manufacturing Board; the NIST Assessment Board; as the chairman of the Assessment Board of DoD Army Research Laboratory and the chairman of the Assessment Board of Army Engineering Centers; and var- ious national panels/committees and international lead- ership positions. She is the author of 600+ publications and several books and is a speaker and author on trade, business, education, and social issues. Her formal education includes four academic degrees, as well as the Harvard Business School Executive Program and Columbia University Corporate Governance Program. For more information, visit JennieHwang.com. To read past columns or contact Hwang, click here. Dr. Hwang will deliver a professional development course on "Preventing Manufac- turing Defects and Product Failure" at the virtual SMTAI conference on October 5 (11:30 a.m.–3:00 p.m.). She will also deliver two courses at the virtual IMAPS Inter- national Microelectronics and Packaging Symposium on October 7 (3:00–5:00 p.m.) and October 8 (1:00–3:00 p.m.) on "Packaging/Board Integrity and Solder Joint Reliability" and "Prevent Product Failure: Tin Whisker and Intermetallic Com- pounds," respectively. Upcoming Presentations