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Page 58 of 111

OCTOBER 2020 I DESIGN007 MAGAZINE 59 Trouble in Your Tank: A Process Engineer's Guide to Electroless Copper E Mike Carano highlights electroless copper plat- ing solutions, focusing on a copper formula- tion based on copper chloride, EDTA, formal- dehyde, and sodium hydroxide. The Right Approach: Leadership Lessons I Learned From Sonny Barger E Countless books have been written about the great leaders throughout history who have served as role models for generations of busi- ness executives. But what about the lessons that can be learned from the names you won't typically find in the business section of your local bookstore? Steve Williams discusses lead- ership lessons he learned from Sonny Barger. Punching Out! Are We Selling a Business or Watching 'Die Hard'? E There is a lot of drama involved in selling a business. According to Wikipedia, the movie series "Die Hard" is about "a police detective who continually finds himself in the middle of violent crises and intrigues where he is the only hope against disaster." Tom Kastner explains how if you use the "strong or power- ful" definition of "violent," that pretty much describes many M&A deals. The Plating Forum: Immersion Plating Reaction in Electronics Manufacturing E Plating or metal deposition is a key component in the manufacturing of electronic packages (circuit boards and integrated circuits). Plat- ing occurs when a metal ion in solution (elec- trolyte) is reduced to the metal. The reduction takes place when electrons are supplied to the ion. George Milad dedicates this column to the immersion reaction. Just Ask John Mitchell: Are IPC's Positions Dictated by Politics? E First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Cam- den in our "Just Ask" series. Now, it's IPC Pres- ident and CEO John Mitchell's turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy "Just Ask John." Better to Light a Candle: Chapter 8— Expanding the Model in This New Reality E Marc Carter posts an update on the collabora- tive grassroots effort to prepare the next gen- eration of PCB "experts" by outlining the prog- ress of efforts to replicate the MTU "prototype" at other industry-academia "nodes" around the country. North American PCB Industry Sales up 10.1% in July E IPC announced the July 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.0. Rogers Introduces RO4450T Glass Reinforced Thermoset Multi-Thickness Bondply E Wireless circuit designers can now enjoy a true breakthrough with Rogers Corporation's RO4450T™ bondply. This product offers design- ers a spread glass reinforced bonding material in seven thickness options ranging between 0.0025" (0.064 mm) and 0.006" (0.152 mm), greatly improving flexibility for high multilayer board count designs.

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