OCTOBER 2020 I DESIGN007 MAGAZINE 59
Trouble in Your Tank: A Process Engineer's
Guide to Electroless Copper E
Mike Carano highlights electroless copper plat-
ing solutions, focusing on a copper formula-
tion based on copper chloride, EDTA, formal-
dehyde, and sodium hydroxide.
The Right Approach: Leadership Lessons
I Learned From Sonny Barger E
Countless books have been written about the
great leaders throughout history who have
served as role models for generations of busi-
ness executives. But what about the lessons
that can be learned from the names you won't
typically find in the business section of your
local bookstore? Steve Williams discusses lead-
ership lessons he learned from Sonny Barger.
Punching Out! Are We Selling a Business
or Watching 'Die Hard'? E
There is a lot of drama involved in selling a
business. According to Wikipedia, the movie
series "Die Hard" is about "a police detective
who continually finds himself in the middle
of violent crises and intrigues where he is
the only hope against disaster." Tom Kastner
explains how if you use the "strong or power-
ful" definition of "violent," that pretty much
describes many M&A deals.
The Plating Forum: Immersion Plating
Reaction in Electronics Manufacturing E
Plating or metal deposition is a key component
in the manufacturing of electronic packages
(circuit boards and integrated circuits). Plat-
ing occurs when a metal ion in solution (elec-
trolyte) is reduced to the metal. The reduction
takes place when electrons are supplied to the
ion. George Milad dedicates this column to the
immersion reaction.
Just Ask John Mitchell: Are IPC's
Positions Dictated by Politics? E
First, we asked you to send in your questions
for Happy Holden, Joe Fjelstad, and Eric Cam-
den in our "Just Ask" series. Now, it's IPC Pres-
ident and CEO John Mitchell's turn! A regular
PCB007 columnist, John focuses on many of
the challenges affecting the global electronics
industry supply chain. Over the years, he has
served as an engineer, manager, and executive
at a variety of companies and organizations.
We hope you enjoy "Just Ask John."
Better to Light a Candle: Chapter 8—
Expanding the Model in This New Reality E
Marc Carter posts an update on the collabora-
tive grassroots effort to prepare the next gen-
eration of PCB "experts" by outlining the prog-
ress of efforts to replicate the MTU "prototype"
at other industry-academia "nodes" around the
country.
North American PCB Industry Sales
up 10.1% in July E
IPC announced the July 2020 findings from its
North American Printed Circuit Board (PCB)
Statistical Program. The book-to-bill ratio
stands at 1.0.
Rogers Introduces RO4450T Glass
Reinforced Thermoset Multi-Thickness
Bondply E
Wireless circuit designers can now enjoy a
true breakthrough with Rogers Corporation's
RO4450T™ bondply. This product offers design-
ers a spread glass reinforced bonding material
in seven thickness options ranging between
0.0025" (0.064 mm) and 0.006" (0.152 mm),
greatly improving flexibility for high multilayer
board count designs.
