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Design007-Oct2020

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22 DESIGN007 MAGAZINE I OCTOBER 2020 Edge plating, as the name suggests, is the process of plating the edges around the PCB. I first saw this technique used at NEC back in 1994. This is an elegant (but expensive) solution to prevent emissions from extremely high-speed SERDES signals on terabit routers, etc. but is an overkill for a typical high-speed design. Another way to mitigate this problem is to create a via fence stitched to ground around the perimeter of the PCB. If the spacing between the stitching vias is less than or equal to one- eighth of a wavelength, the via fencing will appear as a short circuit, causing the propa- gating wave to be reflected back to the source rather than being launched from the PCB edge. A post-production solution is to employ cav- ity resonance absorber material applied along the edge of the PCB, which dissipates the edge radiation from the PCB without using additional board real estate. It also reduces the possibility of board resonance problems by dissipating the energy and not reflecting the energy back into the interior of the board. However, it is always best to fix the problem at the source rather than applying as a quick fix after production. Key Points • Fringing is the bending of the electric flux lines near the edge of the parallel plate capacitors. • A signal passing through a plane cavity may intensify fringing fields. • As core voltages drop, noise margins become tighter. • Signals passing through a plane cavity inject propagating waves, which can excite the cavity resonances. • When the wave meets the PCB edge, the two reference planes form a slot antenna and will radiate noise. • The cavity noise propagates as standing waves spreading across the entire plane pair. • When the cavity has open end boundary conditions, resonances arise when a multiple of half wavelengths can fit between the ends of the cavity. • Return current tends to couple to the signal conductor, falling off in intensity with the square of increased distance. • Avoid positioning critical signals close to the edge of the board. • Edge plating is an elegant (but expensive) solution to prevent emissions from extremely high-speed SERDES signals. • GND stitching vias are placed at one-eighth of a wavelength as a short circuit, causing the propagating wave to be reflected back to the source. • Edge radiation should be eliminated at the source. DESIGN007 Further Reading • Barry Olney, "Beyond Design: Plane Cavity Resonance," The PCB Design Magazine, September 2017. • Barry Olney, "Beyond Design: Mythbusting— There AreNo One-Way Trips!" The PCB Design Magazine, April 2014. • Barry Olney, "Beyond Design: The 10 Fundamental Rules of High-Speed PCB Design, Part 3," Design007 Magazine, November 2018. • Basu (VU2NSB), "Solar Activity and Ionosphere," VU2NSB, November 19, 2019. • Arturo Mediano, "Avoid Critical Signals in Edges of the PCB" In Compliance, December 27, 2018. • Bert Simonovich, "Controlling Electromagnetic Emissions From PCB Edges in Backplanes," Signal Integrity Journal, January 18, 2017. • Mast Technologies, "Reducing PCB Edge Fringing." • Larry D. Smith and Eric Bogatin, Principles of Power Integrity for PDN Design—Simplified, Pearson, March 2017. • Eric Bogatin, "What is the resonant frequency of a cavity? Rule of Thumb #30," EDN, July 19, 2016. Barry Olney is managing director of In-Circuit Design Pty Ltd (iCD), Australia, a PCB design service bureau that specializes in board-level simulation. The company developed the iCD Design Integrity software incorporating the iCD Stackup, PDN, and CPW Planner. The software can be downloaded at icd.com.au. To read past columns or contact Olney, click here.

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