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56 PCB007 MAGAZINE I OCTOBER 2020 Rogers Corporation Introduces SpeedWave 300P Ultra-Low Loss Prepreg E Rogers Corporation is pleased to introduce SpeedWave™ 300P Ultra-Low Loss Prepreg, which addresses the increasing need for stack- up flexibility in high layer count designs for 5G mmWave, high-resolution 77-GHz automotive radar, aerospace and defense, and high-speed digital designs. Ventec Launches High-Speed Material Option Cladded With Thin-Film Resistor Foil E For enhanced high-speed signal-handling per- formance required by the world's most de- manding high-frequency PCB applications, Ventec International Group has launched a laminate option to its tec-speed 20.0 glass-rein- forced hydrocarbon and ceramic laminate clad- ded with thin-film resistor material from Ticer. Limata Launches X1000 Direct Imaging System Platform E Limata, a provider of direct imaging systems for PCB manufacturing and adjacent markets, in- troduces the X1000, a flexible cost-efficient sys- tem platform for dry-film patterning and sol- der mask imaging designed for PCB manufac- turers with quick turnaround production con- figurations. Burkle North America Announces Headquarters Move to Greensboro Technology Center E Burkle North America moved its headquarters from Cypress, California, to the Greensboro Technology Center, effective September 30, 2020. Strategically located service technicians and application support personnel will remain in their respective field offices located through- out the United States. Aismalibar Adds Steven Calvert as Field Applications Engineer E Steven Calvert joins the Aismalibar team with over 25 years' experience working within the European and North American manufacturing industries. Isola Exhibits High-Reliability Copper-Clad Laminates at Virtual PCB West E Isola Group, the leading global and local man- ufacturer of copper-clad laminates and dielec- tric prepregs for use in PCBs, participated in the virtual PCB West conference. MacDermid Alpha to Revolutionize mSAP With New HDI Compatible Low Etch Direct Metallization Processes E MacDermid Alpha Electronics Solutions, a global leader in specialty materials for elec- tronics, announced the release of Blackhole LE and Eclipse LE, significantly upgraded direct metallization technologies for use in the man- ufacture of high-density mobile PCBs. TSK Schill GmbH Supplies Rohde & Schwarz With New Chemical Tin Line E After on-schedule delivery and successful in- stallation of a horizontal chemical tin line at Rohde & Schwarz's Teisnach plant, the custom- er is now equipped for the future. TSK has also succeeded in implementing the requirements of this project with high precision and quality. Ucamco Releases Integr8tor v2020.08, Introduces UcamX Workflow Edition E Ucamco is happy and proud to present Inte- gr8tor v2020.08. The newest release comes with a series of significant improvements, in- cluding the brand new UcamX Workflow Edi- tion (WE) Graphics Editor.

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