56 PCB007 MAGAZINE I OCTOBER 2020
Rogers Corporation Introduces SpeedWave
300P Ultra-Low Loss Prepreg E
Rogers Corporation is pleased to introduce
SpeedWave™ 300P Ultra-Low Loss Prepreg,
which addresses the increasing need for stack-
up flexibility in high layer count designs for 5G
mmWave, high-resolution 77-GHz automotive
radar, aerospace and defense, and high-speed
digital designs.
Ventec Launches High-Speed Material
Option Cladded With Thin-Film
Resistor Foil E
For enhanced high-speed signal-handling per-
formance required by the world's most de-
manding high-frequency PCB applications,
Ventec International Group has launched a
laminate option to its tec-speed 20.0 glass-rein-
forced hydrocarbon and ceramic laminate clad-
ded with thin-film resistor material from Ticer.
Limata Launches X1000 Direct Imaging
System Platform E
Limata, a provider of direct imaging systems for
PCB manufacturing and adjacent markets, in-
troduces the X1000, a flexible cost-efficient sys-
tem platform for dry-film patterning and sol-
der mask imaging designed for PCB manufac-
turers with quick turnaround production con-
figurations.
Burkle North America Announces
Headquarters Move to Greensboro
Technology Center E
Burkle North America moved its headquarters
from Cypress, California, to the Greensboro
Technology Center, effective September 30,
2020. Strategically located service technicians
and application support personnel will remain
in their respective field offices located through-
out the United States.
Aismalibar Adds Steven Calvert as
Field Applications Engineer E
Steven Calvert joins the Aismalibar team with
over 25 years' experience working within the
European and North American manufacturing
industries.
Isola Exhibits High-Reliability Copper-Clad
Laminates at Virtual PCB West E
Isola Group, the leading global and local man-
ufacturer of copper-clad laminates and dielec-
tric prepregs for use in PCBs, participated in
the virtual PCB West conference.
MacDermid Alpha to Revolutionize mSAP
With New HDI Compatible Low Etch Direct
Metallization Processes E
MacDermid Alpha Electronics Solutions, a
global leader in specialty materials for elec-
tronics, announced the release of Blackhole LE
and Eclipse LE, significantly upgraded direct
metallization technologies for use in the man-
ufacture of high-density mobile PCBs.
TSK Schill GmbH Supplies Rohde & Schwarz
With New Chemical Tin Line E
After on-schedule delivery and successful in-
stallation of a horizontal chemical tin line at
Rohde & Schwarz's Teisnach plant, the custom-
er is now equipped for the future. TSK has also
succeeded in implementing the requirements
of this project with high precision and quality.
Ucamco Releases Integr8tor v2020.08,
Introduces UcamX Workflow Edition E
Ucamco is happy and proud to present Inte-
gr8tor v2020.08. The newest release comes
with a series of significant improvements, in-
cluding the brand new UcamX Workflow Edi-
tion (WE) Graphics Editor.
