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© 2020 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. MODIFIED SEMI-ADDITIVE PROCESSING www.macdermidalpha.com Copper Reduction Innerlayer Adhesion Primary Metallization Final Finishes Anisotropic Etching Copper Electroplating BLACKHOLE LE / ECLIPSE LE / SHADOW LE Low-Etch Carbon / Graphite Direct Metallization Processes • Chemical and equipment upgrades allow direct metallization for mSAP • Precise etch removal of activation material for clean via target pads • Eliminates multiple copper plating steps and allows direct plating to micro via target pad and wall CIRCUETCH 100 Precise Copper Thinning for mSAP Foil • Consistent and uniform high speed copper reduction process • Lowers surface roughness without creating topography MACUSPEC VF-TH 200 / 300 Simultaneous Via Filling and Through Hole Plating • Excellent for pattern plating applications such as mSAP and SL-HDI • Fills 3x3 to 5x3 mil vias within 60 minutes with dimples of less than 10 microns AFFINITY ENIG/ENEPIG Electroless Nickel, Palladium, Gold Finishes • Low variation processes for high yields and savings on gold consumption • Excellent solderability • Wire bondable nickel palladium gold finish CIRCUETCH 200 Anisotropic Final Etching Process • Horizontal spray etch for controlled differential etching • Targets base copper layer with minimized sidewall impact We offer solutions for every step in mSAP to increase yields, improve resolution, and reduce costs. M-SPEED HF Low Etch Oxide Alternative • Reduced copper roughness for improved signal integrity • Precision etch rates enable controlled impedance designs