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74 PCB007 MAGAZINE I NOVEMBER 2020 built for less than $250 using plans published by Taiwan Universities as a part of a govern- ment program to have a low-cost analytical unit to detect diabetes in the general popula- tion. They were looking for the same mole- cules that are used as additives for copper plat- ing baths. What Chemical Parameters Can Be Analyzed Table 3 describes chemical parameters that have been analyzed by sensors or instruments and can be integrated into automated units. Here are eight parameters for electroless cop- per and MSAP copper, including four parame- ters for the electroless line. Figure 11 shows a schematic of the high- speed research plating cell for MSAP copper Table 3: What can be analyzed for electroless copper, additive MSAP, and the rest of the electroless line. Figure 11: A home-built automatic plating controller with pulse-plating and automatic chemical control, as well as adjustable eductors for process development of via hole filling.