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macdermidalpha.com © 2020 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. Microvia Reliability we have your solutions for Revolutionary Direct Plating Solutions for Enhanced HDI The Blackhole, Eclipse, Shadow and ENVISION processes enable environmentally friendly, reliable flash-plate free electroplating directly to via structures. Blackhole LE and Eclipse LE significantly improve mSAP yields, trace definition, and allow for higher quality manufacturing. Activator Technologies for Complete Innerlayer Coverage Both the ionic M-Activator AP and colloidal M-Activate provide excellent palladium absorption for full electroless copper coverage. Low Stress Electroless Copper for Improved Adhesion Via Dep 4550 low stress electroless copper can run in many types of equipment with excellent properties. Ensuring Epitaxial Grain Growth at Key Interfaces The MacuSpec VF-TH series copper via filling baths provide an epitaxial grain boundary at the via target pad interface whether using direct metallization technologies like Blackhole, Eclipse, and Shadow or electroless copper processes like the Via Dep 4550 or M-Omega. M-Activate Colloidal Activator M-Activator AP Ionic Activator Direct metallization has fewer metallic interfaces and reduced etching, enabling stacked mSAP-HDI Blackhole + MacuSpec VF-TH 300 ViaDep 4550 + MacuSpec VF-TH 300

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