64 SMT007 MAGAZINE I JANUARY 2021
Henkel joins The Climate Pledge by
Amazon and Global Optimism
E
Henkel reinforces its commitment to climate
protection and joins The Climate Pledge, an
international cross-industry commitment co-
founded by Amazon and Global Optimism. As
a signatory, Henkel commits to achieve net-
zero annual carbon emissions 10 years ahead
of the 2050 target set by the UN Paris Agree-
ment—an ambition in line with the company's
long-term target to become a climate-positive
company by 2040.
The Test Connection's Bill Horner
Remembered
E
Bill Horner, the founder of The Test Connection
Inc. and a well-respected engineer, passed away
on September 21, 2020. He was 81 years old.
Mycronic Partners with Cogiscan to
Provide Machine Connectivity for
Industry 4.0 Applications
E
Mycronic, the leading Swedish high-tech com-
pany providing flexible production solutions
to the electronics manufacturing industry,
announces a new strategic partnership with
Cogiscan Inc., supplier of Track Trace and Con-
trol (TTC) and IIoT solutions, to provide machine
connectivity for Industry 4.0 applications.
Amtech Reports Record Sales for Advanced
Packaging Reflow Systems
E
Amtech Systems, Inc., a manufacturer of cap-
ital equipment, including thermal processing
and wafer polishing, and related consumables,
announced that its subsidiary, BTU Interna-
tional, Inc., achieved record sales for its PYRA-
MAX™ reflow systems sold into advanced
packaging applications in fiscal year ending
September 30, 2020.
PDF Solutions to Acquire Cimetrix
E
PDF Solutions, Inc. announced it has entered
into a definitive agreement to acquire Cime-
trix Incorporated. The combination of Cime-
trix® connectivity products and platforms with
PDF Solutions' Exensio® analytics platform
powered by machine learning, is intended to
enable IC, assembly, and electronics manufac-
turer customers to extract more intelligence–
not just data—from their factory floor, to build
more reliable ICs and systems at lower manu-
facturing costs.
MacDermid Alpha Releases HELIOFAB
AG 7921 High-Brightness Silver for
Leadframe Based LED Packages
E
MacDermid Alpha Electronics Solutions, a
global leader in specialty materials for elec-
tronics, announces the release of HELIOFAB
AG 7921, a high brightness silver electroplat-
ing process for leadframe based LED pack-
ages.
Indium Corporation's Proven Jetting Paste
Recommended by NSW Automation
E
Indium Corporation's newest jetting and
microdispensing solder paste, Indium12.8HF,
has been officially recommended by NSW
Automation for use with their newest micro-
fluid dispenser, SD1.
Seika Machinery Announces Year-end
Sale on Select Products
E
Seika Machinery, Inc., a leading provider of
advanced machinery, materials and engi-
neering services, announces its year-end sale
on select products. Significant savings are
available for McDry cabinets, Sawa portable
handy cleaners and Sayaka PCB routers while
stock lasts.
