Design007 Magazine


Issue link:

Contents of this Issue


Page 34 of 109

FEBRUARY 2021 I DESIGN007 MAGAZINE 35 I hear this all the time: "I want to use a single 0603 footprint for all my 0603 resistor packages. ere are about 22 manufacturers who create 0603 resistors, and I want to use the same foot- print pattern and 3D model for all of them." Well, guess what? You could do that, but you must use the same exact package dimensions and tolerances. If one manufacturer's dimen- sions and tolerances fall out of your master set, then throw that manufacturer off to the side. All of your manufacturers for an 0603-resis- tor package should have the same dimensions and tolerances. ere is no standard for resis- tor package dimensions and tolerances, but if we band together and reject packages that fall outside the mainstream, a de facto stan- dard will eventually emerge. Most chip pack- age dimensions are standard. e package tolerances make a messy PCB library where it generates all these different patterns for an 0603 pattern for a resistor. e main reason for standardizing package dimensions and toler- ances is to reduce the number of footprints in your CAD library. But the big problem is that you can use one manufacturer in your BOM, but the assembly shop may save you money by using a different manufacturer's chips that they have in stock. at's okay, as long as the parts they use match your package dimensions and tolerances. I want to mention that the package and ter- minal tolerances affect the resulting pad stack size and placement. You can have identical nominal package and terminal dimensions, but different tolerances will produce differ- ent footprints. e IPC mathematical includes the tolerances in the land pattern calculation to allow proper solder joints in case the com- ponent is delivered in the minimum, nominal, or maximum material condition. However, I've heard from many assembly shops that most component packages are delivered in the nominal material condition. erefore, you can use a tolerance of zero and greatly reduce the size of your PCB library. If you must use tolerances, standardize them. Matties: anks for your time, Tom. Hausherr: ank you. I enjoyed it. DESIGN007 Shell, C3 AI, Baker Hughes, and Microsoft announced the launch of the Open AI Energy Initiative (OAI), a first-of-its-kind open ecosys- tem of artificial intelligence (AI)-based solu- tions for the energy and pro- cess industries. The OAI pro- vides a framework for energy operators, service providers, equipment providers, and inde- pendent software vendors for energy services to offer interop- erable solutions, including AI and physics-based models, monitoring, diagnostics, pre- scriptive actions, and services, powered by the BHC3 AI Suite and Microsoft Azure. The initial OAI reliability solutions offered by Shell and Baker Hughes enable interoper- ability between BHC3 Reliability, OAI modules, and existing industry solutions for such applica- tions. Solutions available today include proven and tested equipment- and process-spe- cific modules with pre-trained AI models, codified subject mat- ter expertise, low-latency data connectors, thermodynamic and operating parameter librar- ies, global health monitoring services, deep diagnostics, fail- ure prevention recommenda- tions, and prescriptive actions. (Source: Business Wire) Shell, C3 AI, Baker Hughes, Microsoft Launch Open AI Energy Initiative

Articles in this issue

Archives of this issue

view archives of Design007 Magazine - Design007-Feb2021