PCB007 Magazine


Issue link: https://iconnect007.uberflip.com/i/1339822

Contents of this Issue


Page 57 of 125

58 PCB007 MAGAZINE I FEBRUARY 2021 When Component Moisture Levels Become Critical, Encapsulant Damage Can Occur During Reflow Components are Rated With a Moisture Sensitivity Level (MSL) Which Dictates Available Floor Life Oxidation Will Occur When Components Are Improperly Stored, Compromising Solderability If the Floor Life is Exceeded, it is Possible to Restore it Under Carefully Controlled Conditions Dry Air Atmospheres Stop Oxidation Better Than Nitrogen Moisture and surface mount components do not mix. is includes PCBs. e risks fall into two categories: solderability and encapsulant damage. How best to meet this continuously growing challenge? Here are five suggestions: The Top Five Things You Need to Know About MOISTURE MANAGEMENT by Super Dry Totech EU 1 2 3 4 5

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB007-Feb2021