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Page 74 of 111

Microbond® SMT650 Solder Paste Series Maximized Reliability, For Automotive Electronics in Harsh Environments Reduced risk of Dendrite Growth in fine pitch applications Excellent thermal strength, in combination with Innolot alloy Clear residue Excellent printing Efficient wetting Dendrite Growth No Dendrite Growth (SMT650) Preventing electro-migration with Microbond® SMT650 Follow us on @Heraeus Electronics

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