Microbond® SMT650
Solder Paste Series
Maximized Reliability,
For Automotive Electronics in Harsh Environments
Reduced risk of Dendrite Growth
in fine pitch applications
Excellent thermal strength,
in combination with Innolot
alloy
Clear residue
Excellent printing
Efficient wetting
Dendrite Growth
No Dendrite
Growth
(SMT650)
Preventing electro-migration with Microbond® SMT650
www.heraeus-electronics.com
Follow us on
@Heraeus Electronics
