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62 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2021 SHOW & TELL MAGAZINE e best technical con- ference paper of IPC APEX EXPO 2021 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors were recog- nized during show open- ing remarks on Tuesday, March 9. Taking top honors, the winning paper is, "Signal Integrity, Reli- ability, and Cost Evalu- ation of PCB Interlayer Crosstalk Reduction" by Sarah Czaplewski, IBM Corporation. Her co-authors were Roger Krabbenho and Jun- yang Tang, IBM Corporation. is paper was presented during Technical Conference Session 14 (BF5-PCB Design–HDI and Sig- nal Integrity Considerations) on ursday, March 11. is year, two papers were selected in the honorable mention category. Honorable men- tion goes to "Board ickness Effect on Accelerated ermal Cycle Reliability" by Joe Smetana, Nokia. His co-authors included Rich- ard Coyle, Nokia; Eric Lundeen, BAE Systems; Iulia Muntele, Sanmina; Scott Danko, TTM; Neil Hubble, Akrome- trix; and Bev Christian, HDPUG. is paper was presented during Technical Conference Session 9 EE3 (HDP Projects Progress) on Wednesday, March 10. Honorable mention also goes to "Analyz- ing Printed Circuit Board Voiding and other Anomalies when Requirements Cover- ing the Anomalies are Vague" by Wade Gold- man, e Charles Stark Draper Laboratory, Inc. His co-authors were Hai- ley Jordan and Curtis Leonard, e Charles Stark Draper Labora- tory, Inc. is paper was presented during Technical Conference Session 3 EE1 (PCBA Quality, Reliability, and AI-based Inspection) on Wednesday, March 10. e papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illus- trations and the clarity and professionalism of writing as well as value to the industry. Visit for more information on how to access the technical session for 90 days aer the show. S&T Best Technical Paper at IPC APEX EXPO 2021 Selected

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