Issue link: https://iconnect007.uberflip.com/i/1357726
46 SMT007 MAGAZINE I APRIL 2021 aged solder balls. is type of damage is com- mon when components are not packaged in the original tray, tube, or reel provided by the original manufacturer. Even if the component is deemed good by other tests, the fact that the parts are in the wrong package makes them suspect counterfeit. 8. Excessive BGA voiding. Perhaps not seen strictly as counterfeiting, components are oen pulled out of old boards, cleaned, and resold as new. Even if the parts are real, this process can make the parts sub-stan- dard. However, when criminals pull ball grid array (BGA) components from boards, they need to have the parts re-balled. e re-balling process is not trivial. e metal- lurgic interface between the component and the new balls is no longer pristine (as it was when the first balls were applied onto the virgin pads of the component). For this reason, it is common to find recycled BGA components with excessive surface voids. In Figure 7, the bare component shows a large amount of voiding that indicates a part that was pulled and re-balled. 9. Bent pins. An indication of improper storage of compo- nents is bent pins (Figure 8). is X-ray inspec- tion can be done with the components still inside the tray, so they don't need to be removed from the package for a suspect counterfeit determina- tion to be issued. Not only are trays of the wrong size oen used, sometimes the trays with the wrong material are used. In these cases, instead of using the proper material to deal with ESD, coun- terfeiters replace it with lower cost options. ese lower cost material options can damage the parts. 10. Excess die attach voiding. Electronic component manufacturers invest heavily in the consistency of the products they sell. If a few of the components within a lot have anomalous die attach voiding (Figure 9), suspi- cion is drawn to the overall quality of the part and the lot. It may not have been stored in appropri- ate thermal and humidity conditions or may have been salvaged. With incentives at an all-time high for coun- terfeiters, it's a great time to review your receiv- ing practices to ensure that you are keeping fakes out of your inventory and products. A lit- tle extra vigilance can protect your brand, your customers, and help beat the bad guys. SMT007 Dr. Bill Cardoso is CEO of Creative Electron. He is also a I-Connect007 columnist. To read past columns of X-Rayted Files or contact Cardoso, click here. Figure 7: An example of a bare component with a large amount of voiding. Figure 8: Counterfeiters will replace the proper material with lower-cost options. Figure 9: Components with anomalous die attach voiding.