Issue link: https://iconnect007.uberflip.com/i/1367446
MAY 2021 I SMT007 MAGAZINE 61 puting to satisfy even the most demanding applications. Equipment suppliers can improve 3D AOI speed thanks to hardware and optical tech- nology that generates reli- able and repeatable data. These inspection results are then stored in a cen- tral database, which can be used in deploying the opti- mal inspection program for multiple operations and reduce programming and setting condition times. Process optimization is desired by manufactur- ers and equipment suppliers, including manufactur- ers of inspection equipment. However, this optimiza- tion has been difficult to achieve with 2D systems, as most do not offer height information, and cannot accurately measure and quantify shape, coplanarity and solder amount. True 3D AOI systems measure every aspect of the component and solder joint in accordance with the IPC-A-610 standard, and then a significant set of reliable measurement data. Click here for more. mini library contains six to 10 pre-selected vid- eos on the designated topic, priced at $1,200. Topics include electronics assembly inspec- tion, ESD fundamentals, hand soldering and rework—PTH and SMT, intro to electronics assembly (pre-employment training, intro to wire assembly), and others. By equipping students with valuable indus- try-related knowledge through specific online IPC resources and content, IPCEF hopes to address some of the industry's needs: • Lack of awareness of the careers and skills needed to participate in those careers • Shortage of qualified technical candidates because not enough skilled younger workers are entering the electronics industry • An aging workforce • Lack of job preparedness, as many schools are not teaching the students the right curriculum related to industry and career readiness is summer, we will be reaching out to high schools (preferably vocational high schools), technical community colleges, and universi- ties to participate in various IPCEF programs. Our goal is to share relevant industry content with students that will not only create aware- ness but allow them to better understand the skills needed to pursue and access viable career opportunities. Contact Charlene Gunter du Plessis, senior director, IPCEF, at charlene- gunter@ipc.org. SMT007 Charlene Gunter du Plessis is the senior director of the IPC Education Foundation Chapter 2: Performance Anxiety A limitation of many 3D optical inspection systems is the cycle time typically associated with processing millions of pixels to reconstruct a full 3D image using data captured from multiple channels. There should not be a compromise between 3D inspection and throughput. A successful inspection deployment should provide oversight for the process, not com - promise, interrupt or slow that process. The performance or speed of inspection equip- ment falls into two camps. One is the time taken to switch from one inspection program to another. The second is the speed of the individual inspection. The former should be as close to zero as possible and, at worst, not longer than the changeover time of the line. The latter should be at the cadence of a line itself or better. The inspection system should never be the bottleneck on the line or the process that dic - tates the speed at which boards are assembled. Processes Optimized With Reliable Data Some systems capture dozens of unique mea- surement data sets for each field of view. This pro- duces a lot of data, and equipment makers need to manage the big data processing with parallel com- Excerpt—The Printed Circuit Assembler's Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 2