Design007 Magazine

4 DESIGN007 MAGAZINE I MAY 2021 FEATURES PCB Design Challenges: Designing With DDR Interview with Rick Hartley and Barry Olney The Top Five Reasons Products Fail EMI Testing by Kenneth Wyatt Planning and Communication: Key to Optimizing Your Design Time by Chris Young My Ongoing Journey Toward DFM by Kelly Dack Meeting the Challenge With Design Reuse by Stephen V. Chavez FEATURE COLUMN My Top Six Design Challenges by Mark Thompson MAY 2021 • FEATURE CONTENTS It's safe to say that there is no Number 1 PCB design challenge; it's more like a multiverse of problems, to borrow a term from Marvel's movie franchise. So, this month, we asked a select group of expert designers and design engineers to discuss some of the many ongo- ing problems that they face with each design. Top Design Challenges 12 22 46 56 76 40 22 12 46

• Design007 Magazine — May 2021
• Feature Contents — Top Design Challenges
• Additional Contents
• Flex007 Contents
• Column — What Are Your Top Design Challenges?
• Feature Interview — PCB Design Challenges: Designing With DDR
• Feature Article — The Top Five Reasons Products Fail EMI Testing
• Column — A Closer Look at Surface Finish
• Short — Machine Learning Algorithm Helps Unravel the Physics Underlying Quantum Systems
• Feature Column — My Top Six Design Challenges
• Feature Article — Planning and Communication: Key to Optimizing Your Design Time
• Short — Canon Medical Expands AI-Based Image Reconstruction Technology
• Column — DDR Routing—and Other Big Fish in the Lake of Technology
• Feature Article — My Ongoing Journey Toward DFM
• PCB007 Highlights
• Article — Analyzing Complex High-Density PCBs With Online DFM
• Short — Scientists Glimpse Signs of a Puzzling State of Matter in a Superconductor
• Column — Test for Design—How Do You Measure Up?
• Short — Book Excerpt 'The Printed Circuit Designer's Guide to… Thermal Management: A Fabricator's Perspective,' Chapter 2: IMPCBs or MCPCBs
• Feature Article — Meeting the Challenge With Design Reuse
• MilAero007 Highlights
• Column — Pin-Out Challenge: Rethink the Solution
• Short — A Roundup of Stackup Coverage
• Column — Conformal Coating vs. Encapsulation Resin
• Short — New Method Measures Super-Fast, Free Electron Laser Pulses
• Flex007 Column — Designing Via-in-pad for Higher-Density Flexible Circuits
• Short — Plastic Logic's Colour Display Revolutionizes Smart Wearables
• Flex007 Highlights
• Flex007 Column — Process Flow for Occam QFN Test Vehicle
• Top 10 Editor Picks from PCB Design007.com
• Career Opportunities Section
• I-007e Educational Resource Center
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