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8 DESIGN007 MAGAZINE I MAY 2021 APRIL 2021 • CONTENTS FLEX007 COLUMNS Designing Via-in-Pad for Higher-Density Flexible Circuits by John Talbot Process Flow for Occam QFN Test Vehicle by Joe Fjelstad HIGHLIGHTS Flex007 FLEX007 SHORT Plastic Logic's Colour Display Revolutionizes Smart Wearables The challenges facing rigid board designers pale in comparison to those that their flexible brethren must contend with. Flex designers work their black magic in a dynamic, 3D envi- ronment, and almost every design could be considered a custom build. This month, we look into a new process for using copper-filled vias for HDI flex designs. This Month in Flex 92 100 98 96 FLEX 92 100

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