Design007 Magazine

8 DESIGN007 MAGAZINE I MAY 2021 APRIL 2021 • CONTENTS FLEX007 COLUMNS Designing Via-in-Pad for Higher-Density Flexible Circuits by John Talbot Process Flow for Occam QFN Test Vehicle by Joe Fjelstad HIGHLIGHTS Flex007 FLEX007 SHORT Plastic Logic's Colour Display Revolutionizes Smart Wearables The challenges facing rigid board designers pale in comparison to those that their flexible brethren must contend with. Flex designers work their black magic in a dynamic, 3D envi- ronment, and almost every design could be considered a custom build. This month, we look into a new process for using copper-filled vias for HDI flex designs. This Month in Flex 92 100 98 96 FLEX 92 100

• Design007 Magazine — May 2021
• Feature Contents — Top Design Challenges
• Additional Contents
• Flex007 Contents
• Column — What Are Your Top Design Challenges?
• Feature Interview — PCB Design Challenges: Designing With DDR
• Feature Article — The Top Five Reasons Products Fail EMI Testing
• Column — A Closer Look at Surface Finish
• Short — Machine Learning Algorithm Helps Unravel the Physics Underlying Quantum Systems
• Feature Column — My Top Six Design Challenges
• Feature Article — Planning and Communication: Key to Optimizing Your Design Time
• Short — Canon Medical Expands AI-Based Image Reconstruction Technology
• Column — DDR Routing—and Other Big Fish in the Lake of Technology
• Feature Article — My Ongoing Journey Toward DFM
• PCB007 Highlights
• Article — Analyzing Complex High-Density PCBs With Online DFM
• Short — Scientists Glimpse Signs of a Puzzling State of Matter in a Superconductor
• Column — Test for Design—How Do You Measure Up?
• Short — Book Excerpt 'The Printed Circuit Designer's Guide to… Thermal Management: A Fabricator's Perspective,' Chapter 2: IMPCBs or MCPCBs
• Feature Article — Meeting the Challenge With Design Reuse
• MilAero007 Highlights
• Column — Pin-Out Challenge: Rethink the Solution
• Short — A Roundup of Stackup Coverage
• Column — Conformal Coating vs. Encapsulation Resin
• Short — New Method Measures Super-Fast, Free Electron Laser Pulses
• Flex007 Column — Designing Via-in-pad for Higher-Density Flexible Circuits
• Short — Plastic Logic's Colour Display Revolutionizes Smart Wearables
• Flex007 Highlights
• Flex007 Column — Process Flow for Occam QFN Test Vehicle
• Top 10 Editor Picks from PCB Design007.com
• Career Opportunities Section
• I-007e Educational Resource Center
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