Issue link: https://iconnect007.uberflip.com/i/1369942
84 DESIGN007 MAGAZINE I MAY 2021 Golf is my other passion: I have been involved in the LPGA Amateur Association (previously EWGA) since 2001. While learn- ing how golf and the professional world mix, I have been able to take my golfing teams from local to national competitions for the past five years. I could go on about golf, but let's tee up this discussion! Dunn: Impressive! My golf skills stop with my highly developed golf cart driving expertise; actually hitting that ball in a straight line is something I am still working on. You mention Averatek's Community of Interest; this is new. Can you tell me about that? Litson: Averatek, a Silicon Valley innovation company, manufactures key chemistries and licenses the processes for their use. Two pro- cesses, in particular, are having an effect on the PCB design industry: LMI TM , the catalytic ink used in the A-SAP™ process, and Mina™, a surface treatment that enables soldering to aluminum. ese products are now commer- cially available through licensed fabricators, so it is important for designers to learn about them. e Community of Interest is starting to bring together a wide range of people from all sectors of the industry who are interested in learning more about semi-additive PCB pro- cesses. Nothing formal yet, but we're hoping to set up a website or blog to pool our knowl- edge on these types of products. Dunn: What aspect of these new PCB fabrica- tion capabilities is most valuable to you? Litson: I am excited by the ability to route traces at 1 mil or even below, as that opens possibili- ties for designers to produce increased density at lower cost. e A-SAP process provides the designer an opportunity to significantly reduce layer count, simplifying complex designs. ese geometries can potentially eliminate pin-out challenges while maintaining reli- able signal integrity. I can see the advantages of using a taller yet narrower trace for signal integrity; this is the winning factor for me. is process results in traces with vertical rather than trapezoidal sidewalls, realizing benefits in both size and RF advantages, eliminating the etch compensation requirements. Designers working on next-generation prod- ucts will be excited about the ability to form a 15-µm trace and space with the semi-additive processes. Many designs are being driven to require line and spaces at 50 µm due to smaller pin spacing on components and smaller pack- age products. e fabrication of these traces is something that has not been available in the U.S. until now. Dunn: Cherie, I know you are an avid learner; when you are researching new technology, which reliability tests mean the most to you? Figure 2: Cherie is an avid golfer whose teams have gone to national competitions in the past five years.