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MAY 2021 I DESIGN007 MAGAZINE 109 Discussion What has been presented is a novel way to address the increasingly vexing problem that the industry has been battling for decades: effective heat removal from an electronic mod- ule. As one of my trusted advisors, thermal management guru Bernie Siegal, shared with me when I first showed him the idea a dozen years ago, "is approach allows the thermal guys to solve the thermal problems on the front-end design rather than at the end." ose who have skill in the manufacture of printed circuits should be able to appreciate the steps shown, and I trust they can also see how it can be done and accomplished using existing materials equipment and processes. No attempt is being made to identify all the prospective materials, both permanent and process consumable, that might be employed. ere are simply too many to list, especially when the need to endure the soldering process is removed from the list of requirements and assembly must endure during manufacturing. Presently there is an effort underway to build out demonstration Occam assemblies to once and for all remove doubt from the minds of those who have adamantly asserted that the concept will not work. As an optimist, I am inclined to share the words of a kindred icono- clast from early in the last century, Henry Ford, who opined: "Whether you think you can, or you think you can't—you're right." I look forward to sharing the results of the forthcoming efforts with readers when they are available. FLEX007 Joe Fjelstad is founder and CEO of Verdant Electronics and an international authority and innovator in the field of electronic interconnection and packaging technologies with more than 185 patents issued or pending. To read past columns or contact Fjelstad, click here. Download your free copy of Fjelstad's book Flexible Circuit Technology, 4 th Edition, and watch his in-depth workshop series "Flexible Circuit Technology." 12: Remove tape, flash etch electroless copper, fill cavities with optional sinterable conductive paste. Note: Metal paste brings thermal pad to surface level for better access to thermal spreader if desired . Assembly with metal jacket is ESD and EMI immune and largely hermetic. Contacts can be gold plated .