PCB007 Magazine

PCB007-May2021

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MAY 2021 I PCB007 MAGAZINE 111 Career Opportunities Siemens EDA Sr. Applications Engineer Support consultative sales efforts at world's leading semiconductor and electronic equip- ment manufacturers. You will be responsi- ble for securing EM Analysis & Simulation tech- nical wins with the industry-leading HyperLynx Analysis product family as part of the Xpedition Enterprise design flow. Will deliver technical presentations, conduct product demonstrations and benchmarks, and participate in the development of account sales strategies leading to market share gains. • PCB design competency required • BEE, MSEE preferred • Prior experience with Signal Integrity, Power Integrity, EM & SPICE circuit analysis tools • Experience with HyperLynx, Ansys, Keysight and/or Sigrity • A minimum of 5 years' hands-on experience with EM Analysis & Simulation, printed circuit board design, engineering technology or similar field • Moderate domestic travel required • Possess passion to learn and perform at the cutting edge of technology • Desire to broaden exposure to the business aspects of the technical design world • Possess a demonstrated ability to build strong rapport and credibility with customer organizations while maintaining an internal network of contacts • Enjoy contributing to the success of a phenomenal team **Qualified applicants will not require employer- sponsored work authorization now or in the future for employment in the United States. Qualified Ap- plicants must be legally authorized for employ- ment in the United States. Packaging Engineer Job description: The Packaging Engineer de- signs and deploys product packaging to ensure product integrity under varying shipping condi- tions. This individual is responsible for testing, analyzing, and selecting materials for packag- ing based on durability, function, ease of use and cost effectiveness. The Packaging Engi- neer helps ensure that packaging complies with all regulatory requirements. Requirements: Bachelor's degree in engineer- ing, packaging science and at least one year of related work experience. An equivalent com- bination of education and related work experi- ence may be considered. Demonstrable skills with computer-aided design (CAD) software and other relevant programs. Indium Corporation is a premier materials re- finer, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products in- clude solders and fluxes; brazes; thermal inter- face materials; sputtering targets; indium, gal- lium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. Indium Corporation is an Equal Opportunity/Affirmative Action and Minority/ Female/Disability/Protected Veteran Employer. We provide a drug-free work environment and a full benefits package.

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