Issue link: https://iconnect007.uberflip.com/i/1372612
80 PCB007 MAGAZINE I MAY 2021 tatives: Joe O'Neil, CEO, Green Circuits; Sarah Czaplews- ki, reliability engineer, IBM; Brittney Nelson, product engi- neer, Cisco; Christina Trussell, production engineer, Blue Ori- gin; Daniel Heitner, process en- gineer, Summit Interconnect; Paige Fiet, engineering intern, Calumet Electronics; and Jie Fu, design for manufacturing engineering manager, Apple. e virtual event kicked off with two presentations aimed at informing students and ed- ucators of the entire electron- ics manufacturing industry, and subsequently pique their interests in the emerging tech- nologies. Two IPC Hall of Fame Award winners accom- plished this objective: Steve Pudles, CEO, Zentech Man- ufacturing, shared an over- view of the electronics manu- facturing industry, and David Hillman, Engineering Fellow, Collins Aerospace, presented, "e Future of the Industry." Following this, the career pan- elists shared their personal ca- reer journeys, then answered questions from the attendees. e event concluded with a raffle and prizes for a handful of students and educators. An estimated 624 individu- als attended the Career Panel and the feedback we received has been positive. Ninety-four percent of the attendees in- dicated that they were satis- fied with the event and 96% revealed that the information shared was helpful in assisting students with their career jour- Figure 2. Figure 3. Figure 4.